The AM37x generation (AM3715/AM3703) of Sitara™ high-performance microprocessors is based on the enhanced Cortex™-A8 device architecture and is integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and graphics performance while delivering low power consumption.

The device can support numerous high-level operating systems and real-time operating system solutions including Linux, Android and Windows Embedded CE which are available free of charge directly from TI. Additionally, the device is fully backward compatible with previous Cortex-A8 Sitara microprocessors and OMAP™ processors.

The AM3715/AM3703 microprocessor data manual presents the electrical and mechanical specifications for the AM3715/AM3703 microprocessor.

The information contained in this data manual applies to both the commercial and extended temperature versions of the AM3715/03 Microprocessor unless otherwise indicated. It consists of the following sections:

• A description of the AM3715/03 terminals: assignment, electrical characteristics, multiplexing, and functional description
• A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
• The clock specifications: input and output clocks, DPLL and DLL
• A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

• AM3715, AM3703 Sitara ARM Microprocessors:
  • Compatible to OMAP? 3 Architecture
  • MPU Subsystem
    • Up to 1-GHz Sitara? ARM? Cortex?-A8 Core Also supports 300, 600, and 800-MHz operation
    • NEON SIMD Coprocessor
  • POWERVR SGX? Graphics Accelerator (AM3715 only)
    • Tile Based Architecture Delivering up to 20 MPoly/sec
    • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
    • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
    • Fine Grained Task Switching, Load Balancing, and Power Management
    • Programmable High Quality Image Anti-Aliasing
• External Memory Interfaces:
  • SDRAM Controller (SDRC)
    • 16, 32-bit Memory Controller With 1G-Byte Total Address Space
    • Interfaces to Low-Power SDRAM
    • SDRAM Memory Scheduler (SMS) and Rotation Engine
  • General Purpose Memory Controller (GPMC)
    • 16-bit Wide Multiplexed Address/Data Bus
    • Up to 8 Chip Select Pins With 128M-Byte Address Space per Chip Select Pin
    • Glueless Interface to NOR Flash, NAND Flash (With ECC Hamming Code Calculation), SRAM and Pseudo-SRAM
    • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, etc.)
    • Nonmultiplexed Address/Data Mode (Limited 2K-Byte Address Space)

POWERVR SGX is a trademark of Imagination Technologies Ltd. OMAP is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

• Arm CPU
• 1 Arm Cortex-A8
• Arm MHz (Max.)
• 1000
• CPU
• 32-bit
• Display type
• 1 LCD
• Protocols
• Ethernet
• Hardware accelerators
• Image/Video Extension
• Operating system
• Linux, RTOS
• Security
• Cryptography
• Rating
• Catalog
• Operating temperature range (C)
• -40 to 105, -40 to 90, 0 to 90

AM3703的完整型号有：AM3703CUS、AM3703CUS100、AM3703CUSA、AM3703CUSD100、AM3703CBC、AM3703CBC100、AM3703CBCA、AM3703CBCD100、AM3703CBP、AM3703CBP100、AM3703CBPA、AM3703CBPD100，以下是这些产品的关键参数及官网采购报价：

AM3703CUS，工作温度：0 to 90，封装：FCBGA (CUS)-423，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网AM3703CUS的批量USD价格：13.75（1000+）

AM3703CUS100，工作温度：0 to 90，封装：FCBGA (CUS)-423，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网AM3703CUS100的批量USD价格：16.913（1000+）

AM3703CUSA，工作温度：-40 to 105，封装：FCBGA (CUS)-423，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：CU OSP，TI官网AM3703CUSA的批量USD价格：16.5（1000+）

AM3703CUSD100，工作温度：-40 to 90，封装：FCBGA (CUS)-423，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网AM3703CUSD100的批量USD价格：18.975（1000+）

AM3703CBC，工作温度：0 to 90，封装：POP-FCBGA (CBC)-515，包装数量MPQ：119个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网AM3703CBC的批量USD价格：15.813（1000+）

AM3703CBC100，工作温度：0 to 90，封装：POP-FCBGA (CBC)-515，包装数量MPQ：119个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网AM3703CBC100的批量USD价格：18.975（1000+）

AM3703CBCA，工作温度：-40 to 105，封装：POP-FCBGA (CBC)-515，包装数量MPQ：119个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网AM3703CBCA的批量USD价格：18.563（1000+）

AM3703CBCD100，工作温度：-40 to 90，封装：POP-FCBGA (CBC)-515，包装数量MPQ：119个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网AM3703CBCD100的批量USD价格：21.038（1000+）

AM3703CBP，工作温度：0 to 90，封装：POP-FCBGA (CBP)-515，包装数量MPQ：168个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网AM3703CBP的批量USD价格：15.813（1000+）

AM3703CBP100，工作温度：0 to 90，封装：POP-FCBGA (CBP)-515，包装数量MPQ：168个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网AM3703CBP100的批量USD价格：18.975（1000+）

AM3703CBPA，工作温度：-40 to 105，封装：POP-FCBGA (CBP)-515，包装数量MPQ：168个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网AM3703CBPA的批量USD价格：18.563（1000+）

AM3703CBPD100，工作温度：-40 to 90，封装：POP-FCBGA (CBP)-515，包装数量MPQ：168个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网AM3703CBPD100的批量USD价格：21.038（1000+）

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Spectrum Digital XDS200 通过 TI 20 引脚连接器（带有适合 TI 14 引脚、TI 10 引脚和 ARM 20 引脚的多个适配器）连接到目标板，而通过 USB2.0 高速连接 (480Mbps) 连接到主机 PC。要在主机 (...)

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XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件，通过捕获相关器件级信息，获得准确的总线性能活动和吞吐量，并对内核和外设进行电源管理。此外，对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器，所有 XDS (...)

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XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件，通过捕获相关器件级信息，获得准确的总线性能活动和吞吐量，并对内核和外设进行电源管理。此外，对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器，所有 XDS (...)

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虽然起初专为移动手持终端而设计，Android 操作系统仍允许嵌入式应用的设计人员轻松为产品增加高级操作系统。与 Google 联合开发的 Android 是一套可立即实现集成和生产的全面操作系统。

Android 操作系统的亮点在于：

• 完整的开放源码软件解决方案
• 基于 Linux
• 针对商业开发的简洁许可条款 (Apache)
• 包含一个完整的应用框架
• 允许通过 Java 轻松集成定制开发应用
• 开包即用的多媒体、图形和图形用户界面
• 大量 Android 和应用开发人员供随时调遣

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Wind River 是提供物联网 (IoT) 软件的全球领导者。自 1981 年以来，该公司的技术一直在为全世界最安全的器件提供支持，现在已广泛应用于超过 20 亿产品中。Wind River 提供全面的边缘到云产品系列，并针对这些产品提供世界一流的全球专业服务和备受赞誉的客户支持。Wind River 的 VxWorks 和 Linux 产品支持各种 TI 处理器。

如需了解有关 Wind River 的更多信息，请访问 https://www.windriver.com。

发件人： Wind River Systems

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AM/DM37x CBP BSDL Model

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