- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：逻辑门 - 与非门
- 功能描述：具有开漏输出的 4 通道、2 输入、2V 至 6V 与非门
- 点击这里打开及下载CD74HC03的技术文档资料
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The ’HC03 and ’HCT03 logic gates utilize silicon gate CMOS technology to achieve operating speeds similar to LSTTL gates with the low power consumption of standard CMOS integrated circuits. All devices have the ability to drive 10 LSTTL loads. The HCT logic family is functionally as well as pin compatible with the standard LS logic family.
These open drain NAND gates can drive into resistive loads to output voltages as high as 10V. Minimum values of RL required versus load voltage are shown in Figure 2.
- Buffered Inputs
- Typical Propagation Delay: 8ns at VCC = 5V, CL = 15pF, TA = 25°C
- Output Pull-up to 10V
- Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
- Wide Operating Temperature Range . . . –55°C to 125°C
- Balanced Propagation Delay and Transition Times
- Significant Power Reduction Compared to LSTTL Logic ICs
- HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
- HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il 1μA at VOL, VOH
Data sheet acquired from Harris Semiconductor
- Technology Family
- HC
- Supply voltage (Min) (V)
- 2
- Supply voltage (Max) (V)
- 6
- Number of channels (#)
- 4
- Inputs per channel
- 2
- IOL (Max) (mA)
- 5.2
- IOH (Max) (mA)
- 0
- Input type
- Standard CMOS
- Output type
- Open-Drain
- Features
- High speed (tpd 10- 50ns)
- Data rate (Max) (Mbps)
- 28
- Rating
- Catalog
CD74HC03的完整型号有：CD74HC03E、CD74HC03M、CD74HC03M96、CD74HC03MT，以下是这些产品的关键参数及官网采购报价：
CD74HC03E，工作温度：-55 to 125，封装：PDIP (N)-14，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC03E的批量USD价格：.171（1000+）
CD74HC03M，工作温度：-55 to 125，封装：SOIC (D)-14，包装数量MPQ：50个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC03M的批量USD价格：.351（1000+）
CD74HC03M96，工作温度：-55 to 125，封装：SOIC (D)-14，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC03M96的批量USD价格：.151（1000+）
CD74HC03MT，工作温度：-55 to 125，封装：SOIC (D)-14，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC03MT的批量USD价格：.351（1000+）
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
