The CD74HC137, CD74HCT137, ’HC237, and CD74HCT237 are high speed silicon gate CMOS decoders well suited to memory address decoding or data routing applications. Both circuits feature low power consumption usually associated with CMOS circuitry, yet have speeds comparable to low power Schottky TTL logic.

Both circuits have three binary select inputs (A0, A1 and A2) that can be latched by an active High Latch Enable (LE) signal to isolate the outputs from select-input changes. A "Low" LE makes the output transparent to the input and the circuit functions as a one-of-eight decoder. Two Output Enable inputs (OE\₁ and OE₀) are provided to simplify cascading and to facilitate demultiplexing. The demultiplexing function is accomplished by using the A₀, A₁, A₂ inputs to select the desired output and using one of the other Output Enable inputs as the data input while holding the other Output Enable input in its active state. In the CD74HC137 and CD74HCT137 the selected output is a "Low"; in the ’HC237 and CD74HCT237 the selected output is a "High".

• Select One of Eight Data Outputs
  • Active Low for CD74HC137 and CD74HCT137
  • Active High for ’HC237 and CD74HCT237
• I/O Port or Memory Selector
• Two Enable Inputs to Simplify Cascading
• Typical Propagation Delay of 13ns at VCC = 5V, 15pF, TA = 25°C (CD74HC237)
• Fanout (Over Temperature Range)
  • Standard Outputs. . . . 10 LSTTL Loads
  • Bus Driver Outputs. . . . 15 LSTTL Loads
• Wide Operating Temperature Range . . . –55°C to 125°C
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL Logic ICs
• HC Types
  • 2V to 6V Operation
  • High Noise Immunity: NIL = 30%, NIH = 30%, of VCC at VCC = 5V
• HCT Types
  • 4.5V to 5.5V Operation
  • Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
  • CMOS Input Compatibility, Il 1μA at VOL, VOH

Data sheet acquired from Harris Semiconductor

• Technology Family
• HC
• Number of channels (#)
• 1
• Operating temperature range (C)
• -55 to 125
• Rating
• Catalog
• ICC (Max) (uA)
• 160

CD74HC237的完整型号有：CD74HC237E、CD74HC237M、CD74HC237M96、CD74HC237M96G4、CD74HC237NSR、CD74HC237PWR、CD74HC237PWT，以下是这些产品的关键参数及官网采购报价：

CD74HC237E，工作温度：-55 to 125，封装：PDIP (N)-16，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC237E的批量USD价格：.196（1000+）

CD74HC237M，工作温度：-55 to 125，封装：SOIC (D)-16，包装数量MPQ：40个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC237M的批量USD价格：.373（1000+）

CD74HC237M96，工作温度：-55 to 125，封装：SOIC (D)-16，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC237M96的批量USD价格：.173（1000+）

CD74HC237M96G4，工作温度：-55 to 125，封装：SOIC (D)-16，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：-，引脚镀层/焊球材料：-，TI官网CD74HC237M96G4的批量USD价格：.173（1000+）

CD74HC237NSR，工作温度：-55 to 125，封装：SO (NS)-16，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC237NSR的批量USD价格：.188（1000+）

CD74HC237PWR，工作温度：-55 to 125，封装：TSSOP (PW)-16，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SN，TI官网CD74HC237PWR的批量USD价格：.177（1000+）

CD74HC237PWT，工作温度：-55 to 125，封装：TSSOP (PW)-16，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC237PWT的批量USD价格：.373（1000+）

14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM

该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。