- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：触发器、锁存器和寄存器 - 移位寄存器
- 功能描述：具有输入存储的高速 CMOS 逻辑 8 位移位寄存器
- 点击这里打开及下载CD74HC597的技术文档资料
- TI代理渠道，提供当日发货、严格的质量标准，满足您的目标价格
The ’HC597 and CD74HCT597 are high-speed silicon gate CMOS devices that are pin compatible with the LSTTL 597 devices. Each device consists of an 8-flip-flop input register and an 8-bit parallel-in/serial-in, serial-out shift register. Each register is controlled by its own clock. A "low" on the parallel load input (PL\) shifts parallel stored data asynchronously into the shift register. A "low" master input (MR\) clears the shift register. Serial input data can also be synchronously shifted through the shift register when PL\ is high.
- Buffered Inputs
- Asynchronous Parallel Load
- Fanout (Over Temperature Range)
- Standard Outputs...10 LSTTL Loads
- Bus Driver Outputs...15 LSTTL Loads
- Wide Operating Temperature Range... –55°C to 125°C
- Balanced Propagation Delay and Transition Times
- Significant Power Reduction Compared to LSTTL Logic ICs
- HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
- HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il ≤ 1μA at VOL, VOH
Data sheet acquired from Harris Semiconductor
- Configuration
- Universal
- Bits (#)
- 8
- Technology Family
- HC
- Supply voltage (Min) (V)
- 2
- Supply voltage (Max) (V)
- 6
- Input type
- Standard CMOS
- Output type
- Push-Pull
- Clock Frequency (MHz)
- 24
- IOL (Max) (mA)
- 5.2
- IOH (Max) (mA)
- -5.2
- ICC (Max) (uA)
- 160
- Features
- Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode
CD74HC597的完整型号有：CD74HC597E、CD74HC597M、CD74HC597M96、CD74HC597MT、CD74HC597NSR，以下是这些产品的关键参数及官网采购报价：
CD74HC597E，工作温度：-55 to 125，封装：PDIP (N)-16，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC597E的批量USD价格：.183（1000+）
CD74HC597M，工作温度：-55 to 125，封装：SOIC (D)-16，包装数量MPQ：40个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC597M的批量USD价格：.339（1000+）
CD74HC597M96，工作温度：-55 to 125，封装：SOIC (D)-16，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC597M96的批量USD价格：.126（1000+）
CD74HC597MT，工作温度：-55 to 125，封装：SOIC (D)-16，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC597MT的批量USD价格：.339（1000+）
CD74HC597NSR，工作温度：-55 to 125，封装：SO (NS)-16，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HC597NSR的批量USD价格：.151（1000+）
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
