- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：触发器、锁存器和寄存器 - D 型触发器
- 功能描述：具有复位功能的高速 CMOS 逻辑六路 D 型触发器
- 点击这里打开及下载CD74HCT174的技术文档资料
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The ’HC174 and ’HCT174 are edge triggered flip-flops which utilize silicon gate CMOS circuitry to implement D-type flip-flops. They possess low power and speeds comparable to low power Schottky TTL circuits. The devices contain six master-slave flip-flops with a common clock and common reset. Data on the D input having the specified setup and hold times is transferred to the Q output on the low to high transition of the CLOCK input. The MR\ input, when low, sets all outputs to a low state.
Each output can drive ten low power Schottky TTL equivalent loads. The ’HCT174 is functional as well as, pin compatible to the ’LS174.
- Buffered Positive Edge Triggered Clock
- Asynchronous Common Reset
- Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
- Wide Operating Temperature Range . . . -55°C to 125°C
- Balanced Propagation Delay and Transition Times
- Significant Power Reduction Compared to LSTTL Logic ICs
- HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
- HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il 1μA at VOL, VOH
- Number of channels (#)
- 6
- Technology Family
- HCT
- Supply voltage (Min) (V)
- 4.5
- Supply voltage (Max) (V)
- 5.5
- Input type
- TTL-Compatible CMOS
- Output type
- Push-Pull
- Clock Frequency (Max) (MHz)
- 17
- IOL (Max) (mA)
- 4
- IOH (Max) (mA)
- -4
- ICC (Max) (uA)
- 160
- Features
- Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode
CD74HCT174的完整型号有：CD74HCT174E、CD74HCT174M、CD74HCT174M96、CD74HCT174MT，以下是这些产品的关键参数及官网采购报价：
CD74HCT174E，工作温度：-55 to 125，封装：PDIP (N)-16，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网CD74HCT174E的批量USD价格：.155（1000+）
CD74HCT174M，工作温度：-55 to 125，封装：SOIC (D)-16，包装数量MPQ：40个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HCT174M的批量USD价格：.336（1000+）
CD74HCT174M96，工作温度：-55 to 125，封装：SOIC (D)-16，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HCT174M96的批量USD价格：.136（1000+）
CD74HCT174MT，工作温度：-55 to 125，封装：SOIC (D)-16，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HCT174MT的批量USD价格：.336（1000+）
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
