CD74HCT574-EP_TI 增强型产品高速 Cmos 逻辑八路正边沿触发式 D 型触发器，具有

制造厂商：TI
产品类别：逻辑和电压转换
技术类目：触发器、锁存器和寄存器 - D 型触发器
功能描述：增强型产品高速 Cmos 逻辑八路正边沿触发式 D 型触发器，具有
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CD74HCT574-EP的产品详情：

The CD74HCT574 is an octal D-type flip-flop with 3-state outputs and the capability to drive 15 LSTTL loads. The eight edge-triggered flip-flops enter data into their registers on the low-to-high transition of the clock (CP). The output enable (OE)\ controls the 3-state outputs and is independent of the register operation. When OE\ is high, the outputs are in the high-impedance state.

CD74HCT574-EP的优势和特性：

Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
Extended Temperature Performance of –40°C to 125°C
Enhanced Diminishing Manufacturing Sources (DMS) Support
Enhanced Product Change Notification
Qualification Pedigree
Buffered Inputs
Common 3-State Output-Enable Control
3-State Outputs
Bus-Line Driving Capability
Typical Propagation Delay (Clock to Q): 15 ns at VCC = 5 V, CL = 15 pF, TA = 25°C
Fanout (Over Temperature Range)
- Standard Outputs . . . 10 LSTTL Loads
- Bus Driver Outputs . . . 15 LSTTL Loads
Balanced Propagation Delay and Transition Times
Significant Power Reduction Compared to LSTTL Logic ICs
VCC Voltage = 4.5 V to 5.5 V
Direct LSTTL Input Logic Compatibility, VIL = 0.8 V (Max), VIH = 2 V (Min)
CMOS Input Compatibility, Il ≤ 1 μA at VOL, VOH

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

CD74HCT574-EP的参数（英文）：

Number of channels (#)
8
Technology Family
HCT
Supply voltage (Min) (V)
4.5
Supply voltage (Max) (V)
5.5
Input type
TTL-Compatible CMOS
Output type
3-State
Clock Frequency (Max) (MHz)
25
IOL (Max) (mA)
6
IOH (Max) (mA)
-6
ICC (Max) (uA)
80
Features
Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode

CD74HCT574-EP具体的完整产品型号参数及价格（美元）：

CD74HCT574-EP的完整型号有：CD74HCT574QM96EP、CD74HCT574QPWREP、V62/04739-01XE、V62/04739-01YE，以下是这些产品的关键参数及官网采购报价：

CD74HCT574QM96EP，工作温度：-40 to 125，封装：SOIC (DW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HCT574QM96EP的批量USD价格：1.036（1000+）

CD74HCT574QPWREP，工作温度：-40 to 125，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网CD74HCT574QPWREP的批量USD价格：1.036（1000+）

V62/04739-01XE，工作温度：-40 to 125，封装：SOIC (DW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网V62/04739-01XE的批量USD价格：1.036（1000+）

V62/04739-01YE，工作温度：-40 to 125，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网V62/04739-01YE的批量USD价格：1.036（1000+）

CD74HCT574-EP的评估套件：

CD74HCT574-EP的电路图解：

CD74HCT574-EP的评估套件：