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CD74HCT597的基本参数
  • 制造厂商:TI
  • 产品类别:逻辑和电压转换
  • 技术类目:触发器、锁存器和寄存器 - 移位寄存器
  • 功能描述:具有输入存储的高速 CMOS 逻辑 8 位移位寄存器
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CD74HCT597的产品详情:

The ’HC597 and CD74HCT597 are high-speed silicon gate CMOS devices that are pin compatible with the LSTTL 597 devices. Each device consists of an 8-flip-flop input register and an 8-bit parallel-in/serial-in, serial-out shift register. Each register is controlled by its own clock. A "low" on the parallel load input (PL\) shifts parallel stored data asynchronously into the shift register. A "low" master input (MR\) clears the shift register. Serial input data can also be synchronously shifted through the shift register when PL\ is high.

CD74HCT597的优势和特性:
  • Buffered Inputs
  • Asynchronous Parallel Load
  • Fanout (Over Temperature Range)
    • Standard Outputs...10 LSTTL Loads
    • Bus Driver Outputs...15 LSTTL Loads
  • Wide Operating Temperature Range... –55°C to 125°C
  • Balanced Propagation Delay and Transition Times
  • Significant Power Reduction Compared to LSTTL Logic ICs
  • HC Types
    • 2V to 6V Operation
    • High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V
  • HCT Types
    • 4.5V to 5.5V Operation
    • Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max), VIH = 2V (Min)
    • CMOS Input Compatibility, Il ≤ 1μA at VOL, VOH

Data sheet acquired from Harris Semiconductor

CD74HCT597的参数(英文):
  • Configuration
  • Parallel-in, Serial-out
  • Bits (#)
  • 8
  • Technology Family
  • HCT
  • Supply voltage (Min) (V)
  • 4.5
  • Supply voltage (Max) (V)
  • 5.5
  • Input type
  • TTL-Compatible CMOS
  • Output type
  • Push-Pull
  • Clock Frequency (MHz)
  • 24
  • IOL (Max) (mA)
  • 4
  • IOH (Max) (mA)
  • -4
  • ICC (Max) (uA)
  • 160
  • Features
  • Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode
CD74HCT597具体的完整产品型号参数及价格(美元):

CD74HCT597的完整型号有:CD74HCT597E、CD74HCT597M、CD74HCT597M96、CD74HCT597MT,以下是这些产品的关键参数及官网采购报价:

CD74HCT597E,工作温度:-55 to 125,封装:PDIP (N)-16,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:N/A for Pkg Type,引脚镀层/焊球材料:NIPDAU,TI官网CD74HCT597E的批量USD价格:.454(1000+)

CD74HCT597M,工作温度:-55 to 125,封装:SOIC (D)-16,包装数量MPQ:40个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网CD74HCT597M的批量USD价格:.472(1000+)

CD74HCT597M96,工作温度:-55 to 125,封装:SOIC (D)-16,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网CD74HCT597M96的批量USD价格:.399(1000+)

CD74HCT597MT,工作温度:-55 to 125,封装:SOIC (D)-16,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网CD74HCT597MT的批量USD价格:.472(1000+)

轻松满足您的TI芯片采购需求
CD74HCT597的评估套件:

14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM

该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。

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