The CSD95410NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

• 90-A peak continuous current
• Over 95% system efficiency at 30 A
• High-frequency operation (up to 1.75 MHz)
• Diode emulation function
• Temperature compensated bi-directional current sense
• Analog temperature output
• Fault monitoring
• 3.3-V and 5-V PWM signal compatible
• Tri-state PWM input
• Integrated bootstrap switch
• Optimized dead-time for shoot-through protection
• High-density industry common QFN 5-mm × 6-mm footprint
• Ultra-low-inductance package
• System optimized PCB footprint
• Thermally enhanced topside cooling
• RoHS compliant: lead-free terminal plating
• Halogen free

• VDS (V)
• 20
• Power loss (W)
• 2.8
• Ploss current (A)
• 30
• Configuration
• PowerStage
• ID - continuous drain current at Ta=25degC (A)
• 90
• Package (mm)
• QFN 5 x 6 industry common footprint
• Operating temperature range (C)
• -40 to 125

CSD95410RRB的完整型号有：CSD95410RRB、CSD95410RRBT，以下是这些产品的关键参数及官网采购报价：

CSD95410RRB，工作温度：-40 to 125，封装： (RRB)-41，包装数量MPQ：2500个，MSL 等级/回流焊峰值温度：Level-2-260C-1 YEAR，引脚镀层/焊球材料：SN，TI官网CSD95410RRB的批量USD价格：2.42（1000+）

CSD95410RRBT，工作温度：-40 to 125，封装： (RRB)-41，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-2-260C-1 YEAR，引脚镀层/焊球材料：SN，TI官网CSD95410RRBT的批量USD价格：2.42（1000+）

TIDA-010241 — TIDA-010241 适用于高性能 Xilinx 和 Intel FPGA 平台的灵活电源参考设计电路板图像（角度视图）

随着现场可编程门阵列 (FPGA) 的处理能力不断提高，电源轨的数量不断增加，对于每个轨的要求也越来越严格。为了满足这些要求，需要使用电源管理 IC (PMIC) 和控制器为所有电源轨供电并以紧凑的尺寸提供时序控制。