- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:触发器、锁存器和寄存器 - D 型锁存器
- 功能描述:具有三态输出的八路透明 D 型锁存器
- 点击这里打开及下载CY74FCT373T的技术文档资料
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The \x92FCT373T devices consist of eight latches with 3-state outputs for bus-organized applications. When the latch-enable (LE) input is high, the flip-flops appear transparent to the data. Data that meets the required setup times are latched when LE transitions from high to low. Data appears on the bus when the output-enable (OE\) input is low. When OE\ is high, the bus output is in the high-impedance state. In this mode, data can be entered into the latches.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
- Function and Pinout Compatible With FCT and F Logic
- Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
- Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
- Ioff Supports Partial-Power-Down Mode Operation
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Matched Rise and Fall Times
- Fully Compatible With TTL Input and Output Logic Levels
- 3-State Outputs
- CY54FCT373T
- 32-mA Output Sink Current
- 12-mA Output Source Current
- CY74FCT373T
- 64-mA Output Sink Current
- 32-mA Output Source Current
- Number of channels (#)
- 8
- Technology Family
- FCT
- Supply voltage (Min) (V)
- 4.75
- Supply voltage (Max) (V)
- 5.25
- Input type
- TTL-Compatible CMOS
- Output type
- 3-State
- Clock Frequency (Max) (MHz)
- 70
- IOL (Max) (mA)
- 64
- IOH (Max) (mA)
- -32
- ICC (Max) (uA)
- 200
- Features
- Very high speed (tpd 5-10ns), Partial power down (Ioff)
CY74FCT373T的完整型号有:CY74FCT373ATQCT、CY74FCT373ATSOC、CY74FCT373TSOC,以下是这些产品的关键参数及官网采购报价:
CY74FCT373ATQCT,工作温度:-40 to 85,封装:SSOP (DBQ)-20,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网CY74FCT373ATQCT的批量USD价格:.417(1000+)
CY74FCT373ATSOC,工作温度:-40 to 85,封装:SOIC (DW)-20,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网CY74FCT373ATSOC的批量USD价格:.243(1000+)
CY74FCT373TSOC,工作温度:-40 to 85,封装:SOIC (DW)-20,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网CY74FCT373TSOC的批量USD价格:.288(1000+)
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。