TI代理,常备极具竞争力的充足现货
TI哪些型号被关注? TI热门产品型号
DAC5675-EP的基本参数
  • 制造厂商:TI
  • 产品类别:数据转换器
  • 技术类目:数模转换器 (DAC) - 高速数模转换器 (>10MSPS)
  • 功能描述:增强型产品 14 位 400Msps 数模转换器
  • 点击这里打开及下载DAC5675-EP的技术文档资料
  • TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格
快速报价,在行业拥有较高的知名度及影响力
DAC5675-EP的产品详情:

The DAC5675 is a 14-bit resolution high-speed digital-to-analog converter (DAC). The DAC5675 is designed for high-speed digital data transmission in wired and wireless communication systems, high-frequency direct-digital synthesis (DDS), and waveform reconstruction in test and measurement applications. The DAC5675 has excellent spurious-free dynamic range (SFDR) at high intermediate frequencies, which makes it well-suited for multicarrier transmission in TDMA- and CDMA-based cellular base transceiver stations (BTSs).

The DAC5675 operates from a single-supply voltage of 3.3 V. Power dissipation is 660 mW at fCLK = 400 MSPS, fOUT = 70 MHz. The DAC5675 provides a nominal full-scale differential current output of 20 mA, supporting both single-ended and differential applications. The output current can be directly fed to the load with no additional external output buffer required. The output is referred to the analog supply voltage AVDD.

The DAC5675 comprises a low-voltage differential signaling (LVDS) interface for high-speed digital data input. LVDS features a low differential voltage swing with a low constant power consumption across frequency, allowing for high-speed data transmission with low noise levels; that is, with low electromagnetic interference (EMI). LVDS is typically implemented in low-voltage digital CMOS processes, making it the ideal technology for high-speed interfacing between the DAC5675 and high-speed low-voltage CMOS ASICs or FPGAs. The DAC5675 current-source-array architecture supports update rates of up to 400 MSPS. On-chip edge-triggered input latches provide for minimum setup and hold times, thereby relaxing interface timing.

The DAC5675 has been specifically designed for a differential transformer-coupled output with a 50- doubly-terminated load. With the 20-mA full-scale output current, both a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (-2 dBm) is supported. The last configuration is preferred for optimum performance at high output frequencies and update rates. The outputs are terminated to AVDD and have voltage compliance ranges from AVDD - 1 to AVDD + 0.3 V.

An accurate on-chip 1.2-V temperature-compensated bandgap reference and control amplifier allows the user to adjust this output current from 20 mA down to 2 mA. This provides 20-dB gain range control capabilities. Alternatively, an external reference voltage may be applied. The DAC5675 features a SLEEP mode, which reduces the standby power to approximately 18 mW.

The DAC5675 is available in a 48-pin PowerPAD™ thermally-enhanced thin quad flat pack (HTQFP). This package increases thermal efficiency in a standard size IC package. The device is specified for operation over the military temperature range of -55°C to 125°C.

DAC5675-EP的优势和特性:
  • 400-MSPS Update Rate
  • Controlled Baseline
    • One Assembly
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • LVDS-Compatible Input Interface
  • Spurious-Free Dynamic Range (SFDR) to Nyquist
    • 69 dBc at 70 MHz IF, 400 MSPS
  • W-CDMA Adjacent Channel Power Ratio (ACPR)
    • 73 dBc at 30.72-MHz IF, 122.88 MSPS
    • 71 dBc at 61.44-MHz IF, 245.76 MSPS
  • Differential Scalable Current Outputs: 2 mA to 20 mA
  • On-Chip 1.2-V Reference
  • Single 3.3-V Supply Operation
  • Power Dissipation: 660 mW at fCLK = 400 MSPS, fOUT = 20 MHz
  • Package: 48-Pin PowerPAD Thermally-Enhanced Thin Quad Flat Pack (HTQFP) TJA = 29.1°C/W
  • APPLICATIONS
    • Cellular Base Transceiver Station Transmit Channel:
      • CDMA: WCDMA, CDMA2000, IS-95
      • TDMA: GSM, IS-136, EDGE/GPRS
      • Supports Single-Carrier and Multicarrier Applications
    • Test and Measurement: Arbitrary Waveform Generation
    • Military Communications

PowerPAD is a trademark of Texas Instruments.

DAC5675-EP的参数(英文):
  • Resolution (Bits)
  • 14
  • Number of DAC channels (#)
  • 1
  • Interface type
  • Parallel LVDS
  • Sample/update rate (MSPS)
  • 400
  • Features
  • High Performance
  • Rating
  • HiRel Enhanced Product
  • Interpolation
  • 1x
  • Power consumption (Typ) (mW)
  • 820
  • SFDR (dB)
  • 88
  • Architecture
  • Current Sink
  • Operating temperature range (C)
  • -55 to 125
  • Reference type
  • Int
DAC5675-EP具体的完整产品型号参数及价格(美元):

DAC5675-EP的完整型号有:DAC5675MPHPEP、DAC5675MPHPREP、V62/05619-01XE、V62/05619-02XE,以下是这些产品的关键参数及官网采购报价:

DAC5675MPHPEP,工作温度:-55 to 125,封装:HTQFP (PHP)-48,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-3-260C-168 HR,引脚镀层/焊球材料:NIPDAU,TI官网DAC5675MPHPEP的批量USD价格:71.882(1000+)

DAC5675MPHPREP,工作温度:-55 to 125,封装:HTQFP (PHP)-48,包装数量MPQ:1000个,MSL 等级/回流焊峰值温度:Level-3-260C-168 HR,引脚镀层/焊球材料:NIPDAU,TI官网DAC5675MPHPREP的批量USD价格:69.882(1000+)

V62/05619-01XE,工作温度:-55 to 125,封装:HTQFP (PHP)-48,包装数量MPQ:1000个,MSL 等级/回流焊峰值温度:Level-3-260C-168 HR,引脚镀层/焊球材料:NIPDAU,TI官网V62/05619-01XE的批量USD价格:69.882(1000+)

V62/05619-02XE,工作温度:-55 to 125,封装:HTQFP (PHP)-48,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-3-260C-168 HR,引脚镀层/焊球材料:NIPDAU,TI官网V62/05619-02XE的批量USD价格:71.882(1000+)

轻松满足您的TI芯片采购需求
DAC5675-EP的评估套件:

PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice

PSpice for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence 的模拟分析引擎。PSpice for TI 可免费使用,包括业内超大的模型库之一,涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

借助?PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。

在?PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)
TI代理|TI中国代理 - 国内领先的TI芯片采购平台
丰富的可销售TI代理库存,专业的销售团队可随时响应您的紧急需求,目标成为有价值的TI代理