The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

• Portable Data Terminals
• Navigation
• Auto Infotainment
• Gaming
• Medical Imaging
• Home Automation
• Human Interface
• Industrial Control
• Test and Measurement
• Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

• A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
• A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
• The clock specifications: input and output clocks, DPLL and DLL
• A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

• DM3730, DM3725 Digital Media Processors:
  • Compatible with OMAP? 3 Architecture
  • ARM? microprocessor (MPU) Subsystem
    • Up to 1-GHz ARM? Cortex?-A8 Core, Also supports 300, 600, and 800-MHz
    • NEON SIMD Coprocessor
  • High Performance Image, Video, Audio (IVA2.2?) Accelerator Subsystem
    • Up to 800-MHz TMS320C64x+? DSP Core
    • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
    • Video Hardware Accelerators
  • POWER SGX? Graphics Accelerator (DM3730 only)
    • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
    • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
    • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
    • Fine Grained Task Switching, Load Balancing, and Power Management
    • Programmable High Quality Image Anti-Aliasing
  • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+? DSP Core
    • Eight Highly Independent Functional Units
    • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
    • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+? Enhancements
      • Protected Mode Operation
      • Expectations Support for Error Detection and Program Redirection
      • Hardware Support for Modulo Loop Operation
  • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd. OMAP is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

• Arm CPU
• 1 Arm Cortex-A8
• Arm MHz (Max.)
• 800, 1000
• Co-processor(s)
• GPU
• CPU
• 32-bit
• Graphics acceleration
• 1 3D
• Display type
• 2 LCD
• Protocols
• Ethernet
• Hardware accelerators
• 1 Image Video Accelerator, SGX Graphics
• Operating system
• Linux, RTOS
• Rating
• Catalog
• Operating temperature range (C)
• -40 to 105, -40 to 90, 0 to 90

DM3730的完整型号有：DM3730CBC、DM3730CBC100、DM3730CBCA、DM3730CBCD100、DM3730CBP、DM3730CBP100、DM3730CBPA、DM3730CBPD100、DM3730CUS、DM3730CUS100、DM3730CUSA、DM3730CUSD100，以下是这些产品的关键参数及官网采购报价：

DM3730CBC，工作温度：0 to 90，封装：POP-FCBGA (CBC)-515，包装数量MPQ：119个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网DM3730CBC的批量USD价格：19.827（1000+）

DM3730CBC100，工作温度：0 to 90，封装：POP-FCBGA (CBC)-515，包装数量MPQ：119个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网DM3730CBC100的批量USD价格：23.792（1000+）

DM3730CBCA，工作温度：-40 to 105，封装：POP-FCBGA (CBC)-515，包装数量MPQ：119个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网DM3730CBCA的批量USD价格：23.792（1000+）

DM3730CBCD100，工作温度：-40 to 90，封装：POP-FCBGA (CBC)-515，包装数量MPQ：119个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网DM3730CBCD100的批量USD价格：25.775（1000+）

DM3730CBP，工作温度：0 to 90，封装：POP-FCBGA (CBP)-515，包装数量MPQ：168个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网DM3730CBP的批量USD价格：22.801（1000+）

DM3730CBP100，工作温度：0 to 90，封装：POP-FCBGA (CBP)-515，包装数量MPQ：168个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网DM3730CBP100的批量USD价格：26.766（1000+）

DM3730CBPA，工作温度：-40 to 105，封装：POP-FCBGA (CBP)-515，包装数量MPQ：168个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网DM3730CBPA的批量USD价格：23.792（1000+）

DM3730CBPD100，工作温度：-40 to 90，封装：POP-FCBGA (CBP)-515，包装数量MPQ：168个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网DM3730CBPD100的批量USD价格：28.749（1000+）

DM3730CUS，工作温度：0 to 90，封装：FCBGA (CUS)-423，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网DM3730CUS的批量USD价格：19.827（1000+）

DM3730CUS100，工作温度：0 to 90，封装：FCBGA (CUS)-423，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网DM3730CUS100的批量USD价格：23.792（1000+）

DM3730CUSA，工作温度：-40 to 105，封装：FCBGA (CUS)-423，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：CU OSP，TI官网DM3730CUSA的批量USD价格：23.792（1000+）

DM3730CUSD100，工作温度：-40 to 90，封装：FCBGA (CUS)-423，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：Call TI，TI官网DM3730CUSD100的批量USD价格：25.775（1000+）

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