The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8 mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.

The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.

Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.

The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.

The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.

The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.

The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.

Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.

The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.

The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.

• Architecture designed for infotainment applications
• Up to 2 C66x floating-point VLIW DSP
  • Fully object-code compatible with C67x and C64x+
  • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
• Up to 512kB of on-chip L3 RAM
• Level 3 (L3) and Level 4 (L4) interconnects
• Memory Interface (EMIF) module
  • Supports DDR3/DDR3L up to DDR-1066
  • Supports DDR2 up to DDR-800
  • Up to 2GB supported
• Dual Arm? Cortex?-M4 (IPU)
• Vision accelerationPac
  • Embedded Vision Engine (EVE)
• Display subsystem
  • Display controller with DMA engine
  • CVIDEO / SD-DAC TV analog composite output
• On-chip temperature sensor that is capable of generating temperature alerts
• General-Purpose Memory Controller (GPMC)
• Enhanced Direct Memory Access (EDMA) controller
• 3-port (2 external) Gigabit Ethernet (GMAC) switch
• Controller Area Network (DCAN) module
  • CAN 2.0B protocol
• Modular Controller Area Network (MCAN) module
  • CAN 2.0B protocol
• Eight 32-bit general-purpose timers
• Three configurable UART modules
• Four Multichannel Serial Peripheral Interfaces (McSPI)
• Quad SPI interface
• Two Inter-Integrated Circuit (I2C?) ports
• Three Multichannel Audio Serial Port (McASP) modules
• Secure Digital Input Output Interface (SDIO)
• Up to 126 General-Purpose I/O (GPIO) pins
• Power, reset, and clock management
• On-chip debug with CTools technology
• Automotive AEC-Q100 qualified
• 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
• Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
• 8-channel 10-bit ADC
• PWMSS
• Video and image processing support
  • Full-HD video (1920 × 1080p, 60 fps)
  • Video input and video output
  • GPIOs when not used for video
• Video Input Port (VIP) module
  • Support for up to 4 multiplexed input ports

• DSP
• 2 C66x
• DSP MHz (Max)
• 1000
• Operating system
• Linux, Android, RTOS
• Ethernet MAC
• 1000, 2-port 1Gb switch
• TI functional safety category
• Functional Safety-Compliant
• Rating
• Automotive
• Operating temperature range (C)
• -40 to 125

DRA788的完整型号有：DRA788BSGABFQ1、DRA788BSGABFRQ1，以下是这些产品的关键参数及官网采购报价：

DRA788BSGABFQ1，工作温度：-40 to 125，封装：FCBGA (ABF)-367，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-3-250C-168 HR，引脚镀层/焊球材料：Call TI，TI官网DRA788BSGABFQ1的批量USD价格：USD（1000+）

DRA788BSGABFRQ1，工作温度：-40 to 125，封装：FCBGA (ABF)-367，包装数量MPQ：750个，MSL 等级/回流焊峰值温度：Level-3-250C-168 HR，引脚镀层/焊球材料：Call TI，TI官网DRA788BSGABFRQ1的批量USD价格：USD（1000+）

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