- 制造厂商:TI
- 产品类别:电源管理
- 技术类目:直流/直流开关稳压器 - 降压稳压器
- 功能描述:具有同步的 SIMPLE SWITCHER 高效 3A 降压电压稳压器
- 点击这里打开及下载LM2670的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格
The LM2670 series of regulators are monolithic integrated circuits which provide all of the active functions for a step-down (buck) switching regulator capable of driving up to 3-A loads with excellent line and load regulation characteristics. High efficiency (>90%) is obtained through the use of a low ON-resistance DMOS power switch. The series consists of fixed output voltages of 3.3-V, 5-V, and 12-V output version.
The SIMPLE SWITCHER® concept provides for a complete design using a minimum number of external components. The switching clock frequency can be provided by an internal fixed frequency oscillator (260 kHz) or from an externally provided clock in the range of 280 kHz to 400 kHz which allows the use of physically smaller sized components. A family of standard inductors for use with the LM2670 are available from several manufacturers to greatly simplify the design process. The external sync clock provides direct and precise control of the output ripple frequency for consistent filtering or frequency spectrum positioning.
The LM2670 series also has built-in thermal shutdown, current limiting and an ON/OFF control input that can power down the regulator to a low 50-µA quiescent current standby condition. The output voltage is ensured to a ±2% tolerance.
- Efficiency Up to 94%
- Simple and Easy to Design With (Using Off-the- Shelf External Components)
- 150-mΩ DMOS Output Switch
- 3.3-V, 5-V, 12-V Fixed Output and Adjustable (1.2 V to 37 V) Versions
- 50-μA Standby Current When Switched OFF
- ±2% Maximum Output Tolerance Over Full Line and Load Conditions
- Wide Input Voltage Range: 8 V to 40 V
- External Sync Clock Capability (280 kHz to 400 kHz)
- 260-kHz Fixed Frequency Internal Oscillator
- –40 to 125°C Operating Junction Temperature Range
- Vin (Min) (V)
- 6.5
- Vin (Max) (V)
- 40
- Vout (Min) (V)
- 1.23
- Vout (Max) (V)
- 37
- Iout (Max) (A)
- 3
- Iq (Typ) (uA)
- 4200
- Switching frequency (Min) (kHz)
- 260
- Switching frequency (Max) (kHz)
- 400
- Features
- Frequency Synchronization, Over Current Protection
- Rating
- Catalog
- Regulated outputs (#)
- 1
- Control mode
- Voltage Mode
- Duty cycle (Max) (%)
- 91
LM2670的完整型号有:LM2670S-12/NOPB、LM2670S-3.3/NOPB、LM2670S-5.0/NOPB、LM2670S-ADJ/NOPB、LM2670SD-12/NOPB、LM2670SD-3.3/NOPB、LM2670SD-5.0/NOPB、LM2670SD-ADJ/NOPB、LM2670SDX-3.3/NOPB、LM2670SDX-5.0/NOPB、LM2670SDX-ADJ/NOPB、LM2670SX-12/NOPB、LM2670SX-3.3/NOPB、LM2670SX-5.0/NOPB、LM2670SX-ADJ/NOPB、LM2670T-12/NOPB、LM2670T-3.3/NOPB、LM2670T-5.0/NOPB、LM2670T-ADJ/NOPB、LM2670S-5.0、LM2670S-ADJ,以下是这些产品的关键参数及官网采购报价:
LM2670S-12/NOPB,工作温度:-40 to 125,封装:DDPAK/TO-263 (KTW)-7,包装数量MPQ:45个,MSL 等级/回流焊峰值温度:Level-3-245C-168 HR,引脚镀层/焊球材料:SN,TI官网LM2670S-12/NOPB的批量USD价格:2.442(1000+)
LM2670S-3.3/NOPB,工作温度:-40 to 125,封装:DDPAK/TO-263 (KTW)-7,包装数量MPQ:45个,MSL 等级/回流焊峰值温度:Level-3-245C-168 HR,引脚镀层/焊球材料:SN,TI官网LM2670S-3.3/NOPB的批量USD价格:2.442(1000+)
LM2670S-5.0/NOPB,工作温度:-40 to 125,封装:DDPAK/TO-263 (KTW)-7,包装数量MPQ:45个,MSL 等级/回流焊峰值温度:Level-3-245C-168 HR,引脚镀层/焊球材料:SN,TI官网LM2670S-5.0/NOPB的批量USD价格:2.442(1000+)
LM2670S-ADJ/NOPB,工作温度:-40 to 125,封装:DDPAK/TO-263 (KTW)-7,包装数量MPQ:45个,MSL 等级/回流焊峰值温度:Level-3-245C-168 HR,引脚镀层/焊球材料:SN,TI官网LM2670S-ADJ/NOPB的批量USD价格:2.442(1000+)
LM2670SD-12/NOPB,工作温度:-40 to 125,封装:VSON (NHM)-14,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网LM2670SD-12/NOPB的批量USD价格:2.035(1000+)
LM2670SD-3.3/NOPB,工作温度:-40 to 125,封装:VSON (NHM)-14,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网LM2670SD-3.3/NOPB的批量USD价格:2.442(1000+)
LM2670SD-5.0/NOPB,工作温度:-40 to 125,封装:VSON (NHM)-14,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网LM2670SD-5.0/NOPB的批量USD价格:2.442(1000+)
LM2670SD-ADJ/NOPB,工作温度:-40 to 125,封装:VSON (NHM)-14,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网LM2670SD-ADJ/NOPB的批量USD价格:2.442(1000+)
LM2670SDX-3.3/NOPB,工作温度:-40 to 125,封装:VSON (NHM)-14,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网LM2670SDX-3.3/NOPB的批量USD价格:2.035(1000+)
LM2670SDX-5.0/NOPB,工作温度:-40 to 125,封装:VSON (NHM)-14,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网LM2670SDX-5.0/NOPB的批量USD价格:2.035(1000+)
LM2670SDX-ADJ/NOPB,工作温度:-40 to 125,封装:VSON (NHM)-14,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SN,TI官网LM2670SDX-ADJ/NOPB的批量USD价格:2.035(1000+)
LM2670SX-12/NOPB,工作温度:-40 to 125,封装:DDPAK/TO-263 (KTW)-7,包装数量MPQ:500个,MSL 等级/回流焊峰值温度:Level-3-245C-168 HR,引脚镀层/焊球材料:SN,TI官网LM2670SX-12/NOPB的批量USD价格:2.035(1000+)
LM2670SX-3.3/NOPB,工作温度:-40 to 125,封装:DDPAK/TO-263 (KTW)-7,包装数量MPQ:500个,MSL 等级/回流焊峰值温度:Level-3-245C-168 HR,引脚镀层/焊球材料:SN,TI官网LM2670SX-3.3/NOPB的批量USD价格:2.035(1000+)
LM2670SX-5.0/NOPB,工作温度:-40 to 125,封装:DDPAK/TO-263 (KTW)-7,包装数量MPQ:500个,MSL 等级/回流焊峰值温度:Level-3-245C-168 HR,引脚镀层/焊球材料:SN,TI官网LM2670SX-5.0/NOPB的批量USD价格:2.035(1000+)
LM2670SX-ADJ/NOPB,工作温度:-40 to 125,封装:DDPAK/TO-263 (KTW)-7,包装数量MPQ:500个,MSL 等级/回流焊峰值温度:Level-3-245C-168 HR,引脚镀层/焊球材料:SN,TI官网LM2670SX-ADJ/NOPB的批量USD价格:2.035(1000+)
LM2670T-12/NOPB,工作温度:-40 to 125,封装:TO-220 (NDZ)-7,包装数量MPQ:45个,MSL 等级/回流焊峰值温度:Level-1-NA-UNLIM,引脚镀层/焊球材料:SN,TI官网LM2670T-12/NOPB的批量USD价格:2.035(1000+)
LM2670T-3.3/NOPB,工作温度:-40 to 125,封装:TO-220 (NDZ)-7,包装数量MPQ:45个,MSL 等级/回流焊峰值温度:Level-1-NA-UNLIM,引脚镀层/焊球材料:SN,TI官网LM2670T-3.3/NOPB的批量USD价格:2.035(1000+)
LM2670T-5.0/NOPB,工作温度:-40 to 125,封装:TO-220 (NDZ)-7,包装数量MPQ:45个,MSL 等级/回流焊峰值温度:Level-1-NA-UNLIM,引脚镀层/焊球材料:SN,TI官网LM2670T-5.0/NOPB的批量USD价格:2.035(1000+)
LM2670T-ADJ/NOPB,工作温度:-40 to 125,封装:TO-220 (NDZ)-7,包装数量MPQ:45个,MSL 等级/回流焊峰值温度:Level-1-NA-UNLIM,引脚镀层/焊球材料:SN,TI官网LM2670T-ADJ/NOPB的批量USD价格:2.035(1000+)
LM2670S-5.0,工作温度:-40 to 125,封装:DDPAK/TO-263 (KTW)-7,包装数量MPQ:45个,MSL 等级/回流焊峰值温度:Level-3-235C-168 HR,引脚镀层/焊球材料:SNPB,TI官网LM2670S-5.0的批量USD价格:3.358(1000+)
LM2670S-ADJ,工作温度:-40 to 125,封装:DDPAK/TO-263 (KTW)-7,包装数量MPQ:45个,MSL 等级/回流焊峰值温度:Level-3-235C-168 HR,引脚镀层/焊球材料:SNPB,TI官网LM2670S-ADJ的批量USD价格:3.358(1000+)
PSPICE-FOR-TI — 适用于 TI 设计和模拟工具的 PSpice
PSpice for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence 的模拟分析引擎。PSpice for TI 可免费使用,包括业内超大的模型库之一,涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。借助?PSpice for TI 的设计和仿真环境及其内置的模型库,您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案,然后再进行布局和制造,可缩短产品上市时间并降低开发成本。
在?PSpice for TI 设计和仿真工具中,您可以搜索 TI (...)