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MSP430F2111的基本参数
  • 制造厂商:TI
  • 产品类别:微控制器 (MCU) 和处理器
  • 技术类目:微控制器 (MCU) - MSP430 微控制器
  • 功能描述:具有 2KB 闪存、128B SRAM、计时器和比较器的 16MHz MCU
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MSP430F2111的产品详情:

The Texas Instruments MSP430 family of ultra-low-power microcontrollers consist of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 1 µs.

The MSP430x21x1 series is an ultra-low-power mixed signal microcontroller with a built-in 16-bit timer, versatile analog comparator, and sixteen I/O pins.

Typical applications include sensor systems that capture analog signals, convert themto digital values, and then process the data for display or for transmission to a host system. Stand-alone RF sensor front end is another area of application. The analog comparator provides slope A/D conversion capability.

MSP430F2111的优势和特性:
  • Low Supply Voltage Range: 1.8 V to 3.6 V
  • Ultra-Low Power Consumption
    • Active Mode: 250 μA at 1 MHz, 2.2 V
    • Standby Mode: 0.7 μA
    • Off Mode (RAM Retention): 0.1 μA
  • Ultra-Fast Wake-Up From Standby Mode in Less Than 1 μs
  • 16-Bit RISC Architecture, 62.5-ns Instruction Cycle Time
  • Basic Clock Module Configurations
    • Internal Frequencies up to 16 MHz With Four Calibrated Frequencies to ±1%
    • 32-kHz Crystal
    • High-Frequency Crystal up to 16 MHz
    • Resonator
    • External Digital Clock Source
  • 16-Bit Timer_A With Three Capture/Compare Registers
  • On-Chip Comparator for Analog Signal Compare Function or Slope Analog-to-Digital (A/D) Conversion
  • Brownout Detector
  • Serial Onboard Programming, No External Programming Voltage Needed, Programmable Code Protection by Security Fuse
  • Bootstrap Loader
  • On Chip Emulation Module
  • Family Members:
    • MSP430F2101
      • 1KB + 256B Flash Memory
      • 128B RAM
    • MSP430F2111
      • 2KB + 256B Flash Memory
      • 128B RAM
    • MSP430F2121
      • 4KB + 256B Flash Memory
      • 256B RAM
    • MSP430F2131
      • 8KB + 256B Flash Memory
      • 256B RAM
  • Available in a 20-Pin Plastic Small-Outline Wide Body (SOWB) Package, 20-Pin Plastic Small-Outline Thin (TSSOP) Package, 20-Pin TVSOP Package, and 24-Pin QFN Package
  • For Complete Module Descriptions, See the MSP430x2xx Family User's Guide (SLAU144)

MSP430F2111的参数(英文):
  • Non-volatile memory (kB)
  • 2
  • RAM (KB)
  • 0.125
  • ADC
  • Slope
  • GPIO pins (#)
  • 16
  • Features
  • Real-time clock, Brown out detector
  • UART
  • 0
  • USB
  • No
  • Number of I2Cs
  • 0
  • SPI
  • 0
  • Comparator channels (#)
  • 6
MSP430F2111具体的完整产品型号参数及价格(美元):

MSP430F2111的完整型号有:MSP430F2111IDGV、MSP430F2111IDGVR、MSP430F2111IDW、MSP430F2111IDWR、MSP430F2111IPW、MSP430F2111IPWR、MSP430F2111IRGER、MSP430F2111IRGET、MSP430F2111TDGVR、MSP430F2111TDW、MSP430F2111TDWR、MSP430F2111TPW、MSP430F2111TPWR、MSP430F2111TRGER、MSP430F2111TRGET,以下是这些产品的关键参数及官网采购报价:

MSP430F2111IDGV,工作温度:-40 to 85,封装:TVSOP (DGV)-20,包装数量MPQ:90个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111IDGV的批量USD价格:0.979(1000+)

MSP430F2111IDGVR,工作温度:-40 to 85,封装:TVSOP (DGV)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111IDGVR的批量USD价格:0.816(1000+)

MSP430F2111IDW,工作温度:-40 to 85,封装:SOIC (DW)-20,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111IDW的批量USD价格:0.979(1000+)

MSP430F2111IDWR,工作温度:-40 to 85,封装:SOIC (DW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111IDWR的批量USD价格:0.816(1000+)

MSP430F2111IPW,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:70个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111IPW的批量USD价格:0.979(1000+)

MSP430F2111IPWR,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111IPWR的批量USD价格:0.816(1000+)

MSP430F2111IRGER,工作温度:-40 to 85,封装:VQFN (RGE)-24,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111IRGER的批量USD价格:0.816(1000+)

MSP430F2111IRGET,工作温度:-40 to 85,封装:VQFN (RGE)-24,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111IRGET的批量USD价格:0.979(1000+)

MSP430F2111TDGVR,工作温度:-40 to 105,封装:TVSOP (DGV)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111TDGVR的批量USD价格:0.922(1000+)

MSP430F2111TDW,工作温度:-40 to 105,封装:SOIC (DW)-20,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111TDW的批量USD价格:1.085(1000+)

MSP430F2111TDWR,工作温度:-40 to 105,封装:SOIC (DW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111TDWR的批量USD价格:0.922(1000+)

MSP430F2111TPW,工作温度:-40 to 105,封装:TSSOP (PW)-20,包装数量MPQ:70个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111TPW的批量USD价格:1.085(1000+)

MSP430F2111TPWR,工作温度:-40 to 105,封装:TSSOP (PW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111TPWR的批量USD价格:0.922(1000+)

MSP430F2111TRGER,工作温度:-40 to 105,封装:VQFN (RGE)-24,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111TRGER的批量USD价格:0.922(1000+)

MSP430F2111TRGET,工作温度:-40 to 105,封装:VQFN (RGE)-24,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网MSP430F2111TRGET的批量USD价格:1.085(1000+)

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MSP430F2111的评估套件:

MSP-TS430DW28 — MSP-TS430DW28 - 适用于 MSP430F1x 和 MSP430F2x MCU 的 28 引脚目标开发板

MSP-TS430PW28 — MSP-TS430PW28 - 适用于 MSP430F1x 和 MSP430F2x MCU 的 28 引脚目标开发板

MSP-FET — MSP430 闪存仿真工具

MSP-GANG — MSP-GANG 生产编程器

MSP-GRLIB — MSP 图形库

MSP-DSPLIB — MSP 微控制器的数字信号处理 (DSP) 库

MSP430WARE — 适用于 MSP430 微控制器的 MSPWare

UNIFLASH — 适用于大多数 TI 微控制器 (MCU) 和毫米波传感器的 UniFlash

MSP-FLASHER — 适用于 MSP430 和 SimpleLink MSP432 MCU 的命令行编程器

CCSTUDIO — Code Composer Studio 集成式开发环境 (IDE)

MSP430x11x, MSP430F21x1 Code Examples (Rev. Q)

CCSTUDIO-MSP — 适用于 MSP 微控制器的 Code Composer Studio (CCS) 集成开发环境 (IDE)

ENERGYTRACE — EnergyTrace 技术

IAR-KICKSTART — IAR Embedded Workbench

MSP-3P-SEARCH — MSP Third party search tool

MSP430 schematic symbols and footprints library for use with the Eagle CAD tool (Rev. E)

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