devices are based on the enhanced OMAP 3 architecture.

The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

• Streaming video
• Video conferencing
• High-resolution still image

The device supports high-level operating systems (HLOSs), such as:

• Linux®
• Windows® CE
• Android™

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

• Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
• PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP35 device only)
• Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
• Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out.
• Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

• A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption.
• Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

OMAP35 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. (See Table 1-1 for package differences).

This data manual presents the electrical and mechanical specifications for the OMAP35 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP35 applications processors unless otherwise indicated. This data manual consists of the following sections:

• Section 2: Terminal Description: assignment, electrical characteristics, multiplexing, and functional description
• Section 3: Electrical Characteristics: power domains, operating conditions, power consumption, and DC characteristics
• Section 4: Clock Specifications input and output clocks, DPLL and DLL
• Section 5: Video Dac Specifications
• Section 6: Timing Requirements and Switching Characteristics
• Section 7: Package Characteristics: thermal characteristics, device nomenclature, and mechanical data for available packaging

• OMAP3 Devices:
  • OMAP? 3 Architecture
  • MPU Subsystem
    • Up to 720-MHz ARM? Cortex?-A8 Core
    • NEON? SIMD Coprocessor
  • PowerVR? SGX? Graphics Accelerator
    • Tile-Based Architecture Delivering up to 1 MPoly/sec
    • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
    • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
    • Fine-Grained Task Switching, Load Balancing, and Power Management
    • Programmable High-Quality Image Anti-Aliasing
  • Fully Software-Compatible with ARM9?
  • Commercial and Extended Temperature Grades
• ARM Cortex-A8 Core
  • ARMv7 Architecture
    • TrustZone?
    • Thumb?-2
    • MMU Enhancements
  • In-Order, Dual-Issue, Superscalar Microprocessor Core
  • NEON Multimedia Architecture
  • Over 2x Performance of ARMv6 SIMD
  • Supports Both Integer and Floating-Point SIMD
  • Jazelle? RCT Execution Environment Architecture
  • Dynamic Branch Prediction with Branch Target Address Cache, Global History Buffer, and 8-Entry Return Stack
  • Embedded Trace Macrocell (ETM) Support for Noninvasive Debug
• ARM Cortex-A8 Memory Architecture:
  • -KB Instruction Cache (4-Way Set-Associative)
  • -KB Data Cache (4-Way Set-Associative)
  • -KB L2 Cache
• 112KB of ROM
• 64KB of Shared SRAM
• Endianess:
  • ARM Instructions – Little Endian
  • ARM Data – Configurable
• External Memory Interfaces:
  • General Purpose Memory Controller (GPMC)
    • 16-Bit-Wide Multiplexed Address and Data Bus
    • Up to 8 Chip-Select Pins with 128-MB Address Space per Chip-Select Pin
    • Glueless Interface to NOR Flash, NAND Flash (with ECC Hamming Code Calculation), SRAM, and Pseudo-SRAM
    • Flexible Asynchronous Protocol Control for Interface to Custom Logic (FPGA, CPLD, ASICs, and so forth)
    • Nonmultiplexed Address and Data Mode (Limited 2-KB Address Space)
• System Direct Memory Access (sDMA) Controller (32 Logical Channels with Configurable Priority)
• Camera Image Signal Processor (ISP)
  • CCD and CMOS Imager Interface
  • Memory Data Input
  • BT.601 (8-Bit) and BT.656 (10-Bit) Digital YCbCr 4:2:2 Interface
  • Glueless Interface to Common Video Decoders
  • Resize Engine
    • Resize Images From 1/4x to 4x
    • Separate Horizontal and Vertical Control
• Display Subsystem
  • Parallel Digital Output
    • Up to 24-Bit RGB
    • HD Maximum Resolution
    • Supports Up to 2 LCD Panels
    • Support for Remote Frame Buffer Interface (RFBI) LCD Panels
  • 2 10-Bit Digital-to-Analog Converters (DACs) Supporting:
    • Composite NTSC and PAL Video
    • Luma and Chroma Separate Video (S-Video)
  • Rotation 90-, 180-, and 270-Degrees
  • Resize Images From 1/4x to 8x
  • Color Space Converter
  • 8-Bit Alpha Blending
• Serial Communication
  • 5 Multichannel Buffered Serial Ports (McBSPs)
    • 512-Byte Transmit and Receive Buffer (McBSP1, McBSP3, McBSP4, and McBSP5)
    • 5-KB Transmit and Receive Buffer (McBSP2)
    • SIDETONE Core Support (McBSP2 and McBSP3 Only) For Filter, Gain, and Mix Operations
    • Direct Interface to I2S and PCM Device and TDM Buses
    • 128-Channel Transmit and Receive Mode
  • Four Master or Slave Multichannel Serial Port Interface (McSPI) Ports
  • High-, Full-, and Low-Speed USB OTG Subsystem (12- and 8-Pin ULPI Interface)
  • High-, Full-, and Low-Speed Multiport USB Host Subsystem
    • 12- and 8-Pin ULPI Interface or 6-, 4-, and 3-Pin Serial Interface
  • One HDQ?/1-Wire? Interface
  • UARTs (One with Infrared Data Association [IrDA] and Consumer Infrared [CIR] Modes)
  • Three Master and Slave High-Speed Inter-Integrated Circuit (I2C) Controllers
• Removable Media Interfaces:
  • Three Multimedia Card (MMC)/Secure Digital (SD) with Secure Data I/O (SDIO)
• Comprehensive Power, Reset, and Clock Management
  • SmartReflex? Technology
  • Dynamic Voltage and Frequency Scaling (DVFS)
• Test Interfaces
  • IEEE 1149.1 (JTAG) Boundary-Scan Compatible
  • ETM Interface
  • Serial Data Transport Interface (SDTI)
• 12 32-Bit General-Purpose Timers
• 2 32-Bit Watchdog Timers
• 1 32-Bit 32-kHz Sync Timer
• Up to General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
• 5-nm CMOS Technologies
• Package-On-Package (POP) Implementation for Memory Stacking (Not Available in CUS Package)
• Discrete Memory Interface
• Packages:
• 1.8-V I/O and 3.0-V (MMC1 Only), Note: These are default Operating Performance Point (OPP) voltages and could be optimized to lower values using SmartReflex AVS.

• Arm CPU
• 1 Arm Cortex-A8
• Arm MHz (Max.)
• 720
• Co-processor(s)
• GPU
• CPU
• 32-bit
• Graphics acceleration
• 1 3D
• Display type
• 1 LCD
• Hardware accelerators
• SGX Graphics
• Operating system
• Linux, RTOS
• Security
• Cryptography
• Rating
• Catalog
• Power supply solution
• TPS65950, TPS65921
• Operating temperature range (C)
• -40 to 105, 0 to 90

OMAP3515的完整型号有：OMAP3515ECBBA、OMAP3515ECUS、OMAP3515ECUS72、OMAP3515ECUSA、OMAP3515ECBB，以下是这些产品的关键参数及官网采购报价：

OMAP3515ECBBA，工作温度：-40 to 105，封装：POP-FCBGA (CBB)-515，包装数量MPQ：168个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网OMAP3515ECBBA的批量USD价格：28.006（1000+）

OMAP3515ECUS，工作温度：0 to 90，封装：FCBGA (CUS)-423，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-4-260C-72 HR，引脚镀层/焊球材料：CU OSP，TI官网OMAP3515ECUS的批量USD价格：23.338（1000+）

OMAP3515ECUS72，工作温度：0 to 90，封装：FCBGA (CUS)-423，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-4-260C-72 HR，引脚镀层/焊球材料：CU OSP，TI官网OMAP3515ECUS72的批量USD价格：28.006（1000+）

OMAP3515ECUSA，工作温度：-40 to 105，封装：FCBGA (CUS)-423，包装数量MPQ：90个，MSL 等级/回流焊峰值温度：Level-4-260C-72 HR，引脚镀层/焊球材料：CU OSP，TI官网OMAP3515ECUSA的批量USD价格：28.006（1000+）

OMAP3515ECBB，工作温度：0 to 0，封装：POP-FCBGA (CBB)-515，包装数量MPQ：168个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网OMAP3515ECBB的批量USD价格：26.839（1000+）

TMDSEMU200-U — Spectrum Digital XDS200 USB 仿真器

Spectrum Digital XDS200 是最新 XDS200 系列 TI 处理器调试探针（仿真器）的首个模型。XDS200 系列拥有超低成本 XDS100 与高性能 XDS560v2 之间的低成本与高性能的完美平衡。此外，对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器，所有 XDS 调试探针均支持内核和系统跟踪。

Spectrum Digital XDS200 通过 TI 20 引脚连接器（带有适合 TI 14 引脚、TI 10 引脚和 ARM 20 引脚的多个适配器）连接到目标板，而通过 USB2.0 高速连接 (480Mbps) 连接到主机 PC。要在主机 (...)

TMDSEMU560V2STM-U — Blackhawk XDS560v2 系统跟踪 USB 仿真器

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XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件，通过捕获相关器件级信息，获得准确的总线性能活动和吞吐量，并对内核和外设进行电源管理。此外，对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器，所有 XDS (...)

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XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件，通过捕获相关器件级信息，获得准确的总线性能活动和吞吐量，并对内核和外设进行电源管理。此外，对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器，所有 XDS (...)

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虽然起初专为移动手持终端而设计，Android 操作系统仍允许嵌入式应用的设计人员轻松为产品增加高级操作系统。与 Google 联合开发的 Android 是一套可立即实现集成和生产的全面操作系统。

Android 操作系统的亮点在于：

• 完整的开放源码软件解决方案
• 基于 Linux
• 针对商业开发的简洁许可条款 (Apache)
• 包含一个完整的应用框架
• 允许通过 Java 轻松集成定制开发应用
• 开包即用的多媒体、图形和图形用户界面
• 大量 Android 和应用开发人员供随时调遣

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Code Composer Studio™ - Integrated Development Environment for Sitara™ ARM© Processors

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C64XPLUSCODECS — 编解码器 - 视频和语音 - 基于 C64x+ 的器件（OMAP35x、C645x、C647x、DM646、DM644x 和 DM643x）

TI 编解码器免费提供，附带生产许可且现在可供下载。全部经过生产测试，可轻松地集成到音频、视频和语音应用中 单击“获取软件”按钮（上方），以获取经过测试的最新编解码器版本。该页面及每个安装程序中都包含有数据表和发布说明。

其它信息：

• DSP 和 ARM 编解码器 - 当前库存 - 所有 TI 编解码器
• DSP 和 ARM 软件及硬件开发套件 - 所有 SDK 均适用
• 如何将编解码器集成到 DVSDK 中？
• 初级达芬奇和 OMAP 软件
• 用于 TI C64x+ 器件的编解码器性能测量
• TI E2E 社区

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