The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.

The OMAP™ platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.

The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS™ software kernel foundation, and is available in a 289-ball MicroStar BGA package.

The OMAP5910 is targeted at the following applications:

• Applications processing devices
• Mobile communications
  • 802.11
  • Bluetooth™ wireless technology
  • GSM (including GPRS and EDGE)
  • CDMA
  • Proprietary government and other
• Video and image processing (MPEG4, JPEG, Windows® Media Video, etc.)
• Advanced speech applications (text-to-speech, speech recognition)
• Audio processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and other GSM speech codecs)
• Graphics and video acceleration
• Generalized web access
• Data processing (fax, encryption/decryption, authentication, signature verification and watermarking)

• Low-Power, High-Performance CMOS Technology
  • 0.13-μm Technology
  • 1.6-V Core Voltage
• TI925T (MPU) ARM9TDMI? Core
  • Support 32-Bit and 16-Bit (Thumb? Mode) Instruction Sets
  • 16K-Byte Instruction Cache
  • 8K-Byte Data Cache
  • Data and Program Memory Management Units (MMUs)
  • Two 64-Entry Translation Look-Aside Buffers (TLBs) for MMUs
  • 17-Word Write Buffer
• TMS320C55x? (C55x?) DSP Core
  • One/Two Instructions Executed per Cycle
  • Dual Multipliers (Two Multiply-Accumulates per Cycle)
  • Two Arithmetic/Logic Units
  • One Internal Program Bus
  • Five Internal Data/Operand Buses (3 Read Buses and 2 Write Buses)
  • 32K x 16-Bit On-Chip Dual-Access RAM (DARAM) (64K Bytes)
  • 48K x 16-Bit On-Chip Single-Access RAM (SARAM) (96K Bytes)
  • 16K x 16-Bit On-Chip ROM (32K Bytes)
  • Instruction Cache (24K Bytes)
  • Video Hardware Accelerators for DCT, IDCT, Pixel Interpolation, and Motion Estimation for Video Compression
• 192K Bytes of Shared Internal SRAM
• Memory Traffic Controller (TC)
  • 16-Bit EMIFS External Memory Interface to Access up to 128M Bytes of Flash, ROM, or ASRAM
  • 16-Bit EMIFF External Memory Interface to Access up to 64M Bytes of SDRAM
• 9-Channel System DMA Controller
• DSP Memory Management Unit
• Endianism Conversion Logic
• Digital Phase-Locked Loop (DPLL) for MPU/DSP/TC Clocking Control
• DSP Peripherals
  • Three 32-Bit Timers and Watchdog Timer
  • Level1/Level2 Interrupt Handlers
  • Six-Channel DMA Controller
  • Two Multichannel Buffered Serial Ports
  • Two Multichannel Serial Interfaces
• TI925T Peripherals
  • Three 32-Bit Timers and Watchdog Timer
  • 32-kHz Timer
  • Level1/Level2 Interrupt Handlers
  • USB (Full/Low Speed) Host Interface With up to 3 Ports
  • USB (Full Speed) Function Interface
  • One Integrated USB Transceiver for Either Host or Function
  • Multichannel Buffered Serial Port
  • Inter-Integrated Circuit (I2C) Master and Slave Interface
  • Microwire? Serial Interface
  • Multimedia Card (MMC) and Secure Digital (SD) Interface
  • HDQ/1-Wire? Interface
  • Camera Interface for CMOS Sensors
  • ETM9 Trace Module for TI925T Debug
  • Keyboard Matrix Interface (6 x 5 or 8 x 8)
  • Up to Ten MPU General-Purpose I/Os
  • Pulse-Width Tone (PWT) Interface
  • Pulse-Width Light (PWL) Interface
  • Two LED Pulse Generators (LPGs)
  • Real-Time Clock (RTC)
  • LCD Controller With Dedicated System DMA Channel
• Shared Peripherals
  • Three Universal Asynchronous Receiver/Transmitters (UARTs) (One Supporting SIR Mode for IrDA)
  • Four Interprocessor Mailboxes
  • Up to 14 Shared General-Purpose I/Os
• Individual Power-Saving Modes for MPU/DSP/TC
• On-Chip Scan-Based Emulation Logic
• IEEE Std 1149.1 (JTAG) Boundary Scan Logic
• Two 289-Ball MicroStar BGA? (Ball Grid Array) Package Options (GZG and GDY Suffixes)

TMS320C55x, C55x, and MicroStar BGA are trademarks of Texas Instruments. ARM9TDMI is a trademark of ARM Limited. Thumb is a registered trademark of ARM Limited. Microwire is a trademark of National Semiconductor Corporation. 1-Wire is a registered trademark of Dallas Semiconductor Corporation. IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary Scan Architecture. OMAP and DSP/BIOS are trademarks of Texas Instruments. Bluetooth is a trademark owned by Bluetooth SIG, Inc. Windows is a registered trademark of Microsoft Corporation. Other trademarks are the property of their respective owners.

• Arm CPU
• 1 Arm9
• Arm MHz (Max.)
• 192
• Co-processor(s)
• C55x DSP
• CPU
• 32-bit
• Hardware accelerators
• Video Hardware Accelerators for DCT/iDCT, Pixel Interpolation, Motion Estimation for Video Compression
• Operating system
• Linux, RTOS
• Security
• Device identity, Memory protection
• Rating
• Catalog
• Operating temperature range (C)
• -40 to 85

OMAP5910的完整型号有：OMAP5910JGVL2、OMAP5910JZVL2、OMAP5910JGDY2、OMAP5910JZDY2，以下是这些产品的关键参数及官网采购报价：

OMAP5910JGVL2，工作温度：-40 to 85，封装：NFBGA (GVL)-289，包装数量MPQ：160个，MSL 等级/回流焊峰值温度：Level-3-220C-168 HR，引脚镀层/焊球材料：SNPB，TI官网OMAP5910JGVL2的批量USD价格：24.394（1000+）

OMAP5910JZVL2，工作温度：-40 to 85，封装：NFBGA (ZVL)-289，包装数量MPQ：160个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网OMAP5910JZVL2的批量USD价格：24.394（1000+）

OMAP5910JGDY2，工作温度：PropertyValue，封装：BGA (GDY)-289，包装数量MPQ：84个，MSL 等级/回流焊峰值温度：Level-3-220C-168 HR，引脚镀层/焊球材料：SNPB，TI官网OMAP5910JGDY2的批量USD价格：28.785（1000+）

OMAP5910JZDY2，工作温度：PropertyValue，封装：BGA (ZDY)-289，包装数量MPQ：84个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网OMAP5910JZDY2的批量USD价格：28.785（1000+）

PROCESSORS-3P-SEARCH — Arm-based MPU, arm-based MCU and DSP third-party search tool

TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)