OMAP5912 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.

The OMAP™ platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture provides benefits of both DSP and reduced instruction set computer (RISC)technologies, incorporating a TMS320C55x DSP core and a high-performance ARM926EJ-S ARM® core.

• Low-Power, High-Performance CMOS Technology
  • 0.13-μm Technology
  • 192-MHz Maximum Frequency
  • 1.6 ± 5% V Core Voltage
• ARM926EJ-S? (MPU) Core
  • Support for 32-Bit and 16-Bit (Thumb? Mode) Instruction Sets
  • 16K-Byte Instruction Cache
  • 8K-Byte Data Cache
  • Data and Program Memory Management Unit (MMU)
  • 17-Word Write Buffer
  • Two 64-Entry Translation Look-Aside Buffers (TLBs) for MMUs
• TMS320C55x? (C55x?) DSP Core
  • One/Two Instructions Executed per Cycle
  • Dual Multipliers (Two Multiply-Accumulates per Cycle)
  • Two Arithmetic/Logic Units
  • Five Internal Data/Operand Buses (3 Read Buses and 2 Write Buses)
  • 32K x 16-Bit On-Chip Dual-Access RAM (DARAM) (64K Bytes)
  • 48K x 16-Bit On-Chip Single-Access RAM (SARAM) (96K Bytes)
  • Instruction Cache (24K Bytes)
  • Video Hardware Accelerators for DCT, iDCT, Pixel Interpolation, and Motion Estimation for Video Compression
• 250K Bytes of Shared Internal SRAM
• Memory Traffic Controller (TC)
  • 16-Bit EMIFS Supports up to 256M Bytes of External Memory (i.e., Async. ROM/RAM, NOR/NAND Flash, and Sync. Burst Flash)
  • 16-Bit EMIFF to Access up to 64M Bytes of SDRAM, Mobile SDRAM, or Mobile DDR
• DSP Memory Management Unit
• DSP Peripherals
  • Three 32-Bit Timers and Watchdog Timer
  • Six-Channel DMA Controller
  • Two Multichannel Buffered Serial Ports
  • Two Multichannel Serial Interfaces
• MPU Peripherals
  • Three 32-Bit Timers and Watchdog Timer
  • USB 1.1 Host and Client Controllers
  • USB On-the-Go (OTG) Controller
  • 3 USB Ports, One With an Integrated Transceiver
  • Camera Interface for Parallel CMOS Sensors
  • Real-Time Clock (RTC)
  • Pulse-Width Tone (PWT) Interface
  • Pulse-Width Light (PWL) Interface
  • Keyboard Matrix Interface (6 x 5 or 8 x 8)
  • HDQ/1-Wire? Interface
  • Multimedia Card (MMC) and Secure Digital (SD) Interface
  • Up to 16 MPU General-Purpose I/Os
  • Two LED Pulse Generators (LPGs)
  • ETM9? Trace Module for ARM926EJ-S Debug
  • 16-/18-Bit LCD Controller With Dedicated System DMA Channel
  • 32-kHz Operating System (OS) Timer
• Shared Peripherals
  • 8 General-Purpose Timers
  • Serial Port Interface (SPI)
  • Three Universal Asynchronous Receiver/Transmitters (UARTs) (Two Supporting SIR mode for IrDA)
  • Inter-Integrated Circuit (I2C) Master and Slave Interface
  • Multimedia Card (MMC) and Secure Digital (SD) Interface
  • Multichannel Buffered Serial Port
  • Up to 64 Shared General-Purpose I/Os
  • 32-kHz Synchro Counter
• Endian Conversion Unit
• Hardware Accelerators for Cryptographic Functions
  • Random Number Generation
  • DES and 3DES
  • SHA-1 and MD5
• Individual Power-Saving Modes for MPU/DSP/TC
• On-Chip Scan-Based Emulation Logic
• IEEE Std 1149.1 (JTAG) Boundary Scan Logic
• Three 289-Ball BGA (Ball Grid Array) Packages (ZDY and ZZG - Lead-Free; GDY - With Lead)
• The OMAP5912 device is targeted at the following applications:
  • Applications Processing Devices
  • Mobile Communications
    • WAN 802.11X
    • Bluetooth?
    • GSM, GPRS, EDGE
    • CDMA
  • Video and Image Processing (MPEG4, JPEG, Windows? Media Video, etc.)
  • Advanced Speech Applications (text-to-speech, speech recognition)
  • Audio Processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and Other GSM Speech Codecs)
  • Graphics and Video Acceleration
  • Generalized Web Access
  • Data Processing

IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary Scan Architecture. TMS320C55x, C55x, OMAP, and DSP/BIOS are trademarks of Texas Instruments. ARM926EJ-S and ETM9 are trademarks of ARM Limited in the EU and other countries. Thumb and ARM are registered trademarks of ARM Limited in the EU and other countries. 1-Wire is a registered trademark of Dallas Semiconductor Corporation. Bluetooth is a trademark owned by Bluetooth SIG, Inc. Windows is a registered trademark of Microsoft Corporation in the United States and/or other countries.

• Arm CPU
• 1 Arm9
• Arm MHz (Max.)
• 192
• Co-processor(s)
• C55x DSP
• CPU
• 32-bit
• Hardware accelerators
• Image/Video Extension
• Operating system
• Linux, RTOS
• Security
• Cryptography, Device identity, Memory protection
• Rating
• Catalog
• Operating temperature range (C)
• -40 to 85

OMAP5912的完整型号有：OMAP5912ZVL、OMAP5912ZVLR、OMAP5912ZDY，以下是这些产品的关键参数及官网采购报价：

OMAP5912ZVL，工作温度：-40 to 85，封装：NFBGA (ZVL)-289，包装数量MPQ：160个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网OMAP5912ZVL的批量USD价格：25.832（1000+）

OMAP5912ZVLR，工作温度：-40 to 85，封装：NFBGA (ZVL)-289，包装数量MPQ：1000个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网OMAP5912ZVLR的批量USD价格：23.832（1000+）

OMAP5912ZDY，工作温度：PropertyValue，封装：BGA (ZDY)-289，包装数量MPQ：84个，MSL 等级/回流焊峰值温度：Level-3-260C-168 HR，引脚镀层/焊球材料：SNAGCU，TI官网OMAP5912ZDY的批量USD价格：27.236（1000+）

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