TI代理,常备极具竞争力的充足现货
TI哪些型号被关注? TI热门产品型号
SM320VC5421-EP的基本参数
  • 制造厂商:TI
  • 产品类别:微控制器 (MCU) 和处理器
  • 技术类目:处理器 - 数字信号处理器 (DSP)
  • 功能描述:增强型产品低功耗 C5421 定点 DSP
  • 点击这里打开及下载SM320VC5421-EP的技术文档资料
  • TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格
快速报价,在行业拥有较高的知名度及影响力
SM320VC5421-EP的产品详情:

The 320VC5421 fixed-point digital signal processor (DSP) is a dual-core solution running at 200-MIPS performance. The 5421 consists of two DSP subsystems capable of core-to-core communications and a 128K-word zero-wait-state on-chip program memory shared by the two DSP subsystems. Each subsystem consists of one 54x DSP core, 32K-word program/data DARAM, 32K-word data SARAM, 2K-word ROM, three multichannel serial interfaces, xDMA logic, one timer, one APLL, and other miscellaneous circuitry.

The 5421 also contains a host-port interface (HPI) that allows the 5421 to be viewed as a memory-mapped peripheral to a host processor. The 5421 is pin-compatible with the TMS320VC5420.

Each subsystem has its separate program and data spaces, allowing simultaneous accesses to program instructions and data. Two read operations and one write operation can be performed in one cycle. Instructions with parallel store and application-specific instructions can fully utilize this architecture. Furthermore, data can be transferred between program and data spaces. Such parallelism supports a powerful set of arithmetic, logic, and bit-manipulation operations that can all be performed in a single machine cycle. The 5421 includes the control mechanisms to manage interrupts, repeated operations, and function calls. In addition, the 5421 has 128K words of on-chip program memory that can be shared between the two subsystems.

The 5421 is intended as a high-performance, low-cost, high-density DSP for remote data access or voice-over IP subsystems. It is designed to maintain the current modem architecture with minimal hardware and software impacts, thus maximizing reuse of existing modem technologies and development efforts.

SM320VC5421-EP的优势和特性:
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 85°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • 200-MIPS Dual-Core DSP Consisting of Two Independent Subsystems
  • Each Core Has an Advanced Multibus Architecture With Three Separate 16-Bit Data Memory Buses and One Program Bus
  • 40-Bit Arithmetic Logic Unit (ALU) Including a 40-Bit Barrel-Shifter and Two 40-Bit Accumulators Per Core
  • Each Core Has a 17-Bit × 17-Bit Parallel Multiplier Coupled to a 40-Bit Adder for Non-Pipelined Single-Cycle Multiply/Accumulate (MAC) Operations
  • Each Core Has a Compare, Select, and Store Unit (CSSU) for the Add/Compare Selection of the Viterbi Operator
  • Each Core Has an Exponent Encoder to Compute an Exponent Value of a 40-Bit Accumulator Value in a Single Cycle
  • Each Core Has Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs)
  • 16-Bit Data Bus With Data Bus Holder Feature
  • 512K-Word × 16-Bit Extended Program Address Space
  • Total of 256K-Word × 16-Bit Dual- and Single-Access On-Chip RAM (128K-Word x 16-Bit Two-Way Shared Memory)
  • Single-Instruction Repeat and Block-Repeat Operations
  • Instructions With 32-Bit-Long Word Operands
  • Instructions With Two or Three Operand Reads
  • Fast Return From Interrupts
  • Arithmetic Instructions With Parallel Store and Parallel Load
  • Conditional Store Instructions
  • Output Control of CLKOUT
  • Output Control of TOUT
  • Power Consumption Control With IDLE1, IDLE2, and IDLE3 Instructions
  • Dual 1.8-V (Core) and 3.3-V (I/O) Power Supplies for Low-Power, Fast Operations
  • 10-ns Single-Cycle Fixed-Point Instruction
  • Interprocessor Communication via Two Internal 8-Element FIFOs
  • Twelve Channels of Direct Memory Access (DMA) for Data Transfers With No CPU Loading (Six Channels Per Subsystem With External Access)
  • Six Multichannel Buffered Serial Ports (McBSPs) With 128-Channel Selection Capability (Three McBSPs per Subsystem)
  • 16-Bit Host-Port Interface (HPI) Multiplexed With External Memory Interface Pins
  • Software-Programmable Phase-Locked Loop (APLL) Provides Several Clocking Options (Requires External Oscillator)
  • On-Chip Scan-Based Emulation Logic, IEEE Standard 1149-1 (JTAG) Boundary-Scan Logic
  • Two Software-Programmable Timers (One Per Subsystem)
  • Software-Programmable Wait-State Generator (14 Wait States Maximum)
  • Provided in 144-pin Low-Profile Quad Flatpack (LQFP) (PGE Suffix) Package

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.

SM320VC5421-EP的参数(英文):
  • DSP
  • 1 C54x
  • DSP MHz (Max)
  • 100
  • CPU
  • 16-bit
  • Rating
  • HiRel Enhanced Product
  • Operating temperature range (C)
  • -40 to 85
SM320VC5421-EP具体的完整产品型号参数及价格(美元):

SM320VC5421-EP的完整型号有:SM320VC5421PGE20EP、V62/04607-01XE,以下是这些产品的关键参数及官网采购报价:

SM320VC5421PGE20EP,工作温度:-40 to 85,封装:LQFP (PGE)-144,包装数量MPQ:60个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SM320VC5421PGE20EP的批量USD价格:80.749(1000+)

V62/04607-01XE,工作温度:-40 to 85,封装:LQFP (PGE)-144,包装数量MPQ:60个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网V62/04607-01XE的批量USD价格:80.749(1000+)

轻松满足您的TI芯片采购需求
SM320VC5421-EP的评估套件:

TMDSEMU560V2STM-U — Blackhawk XDS560v2 系统跟踪 USB 仿真器

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS (...)

TMDSEMU560V2STM-UE — Spectrum Digital XDS560v2 系统跟踪 USB 和以太网

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS (...)

PROCESSORS-3P-SEARCH — Arm-based MPU, arm-based MCU and DSP third-party search tool

TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
TI代理|TI中国代理 - 国内领先的TI芯片采购平台
丰富的可销售TI代理库存,专业的销售团队可随时响应您的紧急需求,目标成为有价值的TI代理