- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：触发器、锁存器和寄存器 - D 型锁存器
- 功能描述：具有三态输出的 16 位透明 D 类锁存器
- 点击这里打开及下载SN74ABT16373A的技术文档资料
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The 'ABT16373A are 16-bit transparent D-type latches with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
These devices can be used as two 8-bit latches or one 16-bit latch. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels set up at the D inputs.
A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.
OE\ does not affect internal operations of the latch. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT16373A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16373A is characterized for operation from -40°C to 85°C.
- Members of the Texas Instruments WidebusTM Family
- State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 5 V, TA = 25°C
- High-Impedance State During Power Up and Power Down
- Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
- Flow-Through Architecture Optimizes PCB Layout
- High-Drive Outputs (-32-mA IOH, 64-mA IOL)
- Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings
Widebus and EPIC-IIB are trademarks of Texas Instruments Incorporated.
- Number of channels (#)
- 16
- Technology Family
- ABT
- Supply voltage (Min) (V)
- 4.5
- Supply voltage (Max) (V)
- 5.5
- Input type
- TTL-Compatible CMOS
- Output type
- 3-State
- Clock Frequency (Max) (MHz)
- 150
- IOL (Max) (mA)
- 64
- IOH (Max) (mA)
- -32
- ICC (Max) (uA)
- 85000
- Features
- Very high speed (tpd 5-10ns), Partial power down (Ioff), Power up 3-state, Flow-through pinout
SN74ABT16373A的完整型号有：SN74ABT16373ADGGR、SN74ABT16373ADL、SN74ABT16373ADLR，以下是这些产品的关键参数及官网采购报价：
SN74ABT16373ADGGR，工作温度：-40 to 85，封装：TSSOP (DGG)-48，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT16373ADGGR的批量USD价格：.527（1000+）
SN74ABT16373ADL，工作温度：-40 to 85，封装：SSOP (DL)-48，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT16373ADL的批量USD价格：.738（1000+）
SN74ABT16373ADLR，工作温度：-40 to 85，封装：SSOP (DL)-48，包装数量MPQ：1000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT16373ADLR的批量USD价格：.632（1000+）
SN74ABT16373ADGGR，工作温度：-40 to 85，封装：TSSOP (DGG)-48，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT16373ADGGR的批量USD价格：.527（1000+）
SN74ABT16373ADL，工作温度：-40 to 85，封装：SSOP (DL)-48，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT16373ADL的批量USD价格：.738（1000+）
SN74ABT16373ADLR，工作温度：-40 to 85，封装：SSOP (DL)-48，包装数量MPQ：1000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT16373ADLR的批量USD价格：.632（1000+）
