- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：缓冲器、驱动器和收发器 - 通用收发器
- 功能描述：具有三态输出的 18 位通用总线收发器
- 点击这里打开及下载SN74ABT16500B的技术文档资料
- TI代理渠道，提供当日发货、严格的质量标准，满足您的目标价格
These 18-bit universal bus transceivers combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, and clocked modes.
Data flow in each direction is controlled by output-enable (OEAB and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB\ and CLKBA\) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB\ is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the high-to-low transition of CLKAB\. OEAB is active-high. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.
Data flow for B to A is similar to that of A to B but uses OEBA\, LEBA, and CLKBA\. The output enables are complementary (OEAB is active high and OEBA\ is active low).
When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.
The SN54ABT16500B is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16500B is characterized for operation from -40°C to 85°C.
- Members of the Texas Instruments WidebusTM Family
- State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
- UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 5 V, TA = 25°C
- High-Impedance State During Power Up and Power Down
- Flow-Through Architecture Optimizes PCB Layout
- Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings
Widebus, EPIC-IIB, and UBT are trademarks of Texas Instruments Incorporated.
- IOL (Max) (mA)
- 64
- IOH (Max) (mA)
- -32
- Technology Family
- ABT
- Rating
- Catalog
- Operating temperature range (C)
- -40 to 85
SN74ABT16500B的完整型号有：SN74ABT16500BDGGR、SN74ABT16500BDL、SN74ABT16500BDLR，以下是这些产品的关键参数及官网采购报价：
SN74ABT16500BDGGR，工作温度：-40 to 85，封装：TSSOP (DGG)-56，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT16500BDGGR的批量USD价格：1.481（1000+）
SN74ABT16500BDL，工作温度：-40 to 85，封装：SSOP (DL)-56，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT16500BDL的批量USD价格：1.925（1000+）
SN74ABT16500BDLR，工作温度：-40 to 85，封装：SSOP (DL)-56，包装数量MPQ：1000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT16500BDLR的批量USD价格：1.629（1000+）
SN74ABT16500BDGGR，工作温度：-40 to 85，封装：TSSOP (DGG)-56，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT16500BDGGR的批量USD价格：1.481（1000+）
SN74ABT16500BDL，工作温度：-40 to 85，封装：SSOP (DL)-56，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT16500BDL的批量USD价格：1.925（1000+）
SN74ABT16500BDLR，工作温度：-40 to 85，封装：SSOP (DL)-56，包装数量MPQ：1000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT16500BDLR的批量USD价格：1.629（1000+）
