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SN74ABT16501的基本参数
  • 制造厂商:TI
  • 产品类别:逻辑和电压转换
  • 技术类目:缓冲器、驱动器和收发器 - 通用收发器
  • 功能描述:具有三态输出的 18 位通用总线收发器
  • 点击这里打开及下载SN74ABT16501的技术文档资料
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SN74ABT16501的产品详情:

These 18-bit universal bus transceivers consist of storage elements that can operate either as D-type latches or D-type flip-flops to allow data flow in transparent or clocked modes.

Data flow in each direction is controlled by output-enable (OEAB and ), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state.

Data flow for B to A is similar to that of A to B but uses, LEBA, and CLKBA. The output enables are complementary (OEAB is active high and is active low).

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor and should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sourcing/current-sinking capability of the driver.

 

The SN54ABT16501 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT16501 is characterized for operation from -40°C to 85°C.

 

 

 

SN74ABT16501的优势和特性:
  • Members of the Texas Instruments WidebusTM Family
  • State-of-the-Art EPIC-IIBTM BiCMOS Design Significantly Reduces Power Dissipation
  • UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 5 V, TA = 25°C
  • Flow-Through Architecture Optimizes PCB Layout
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

Widebus, EPIC-IIB, and UBT are trademarks of Texas Instruments Incorporated.

SN74ABT16501的参数(英文):
  • IOL (Max) (mA)
  • 64
  • IOH (Max) (mA)
  • -32
  • Technology Family
  • ABT
  • Rating
  • Catalog
  • Operating temperature range (C)
  • -40 to 85
SN74ABT16501具体的完整产品型号参数及价格(美元):

SN74ABT16501的完整型号有:SN74ABT16501DGGR、SN74ABT16501DL、SN74ABT16501DLR,以下是这些产品的关键参数及官网采购报价:

SN74ABT16501DGGR,工作温度:-40 to 85,封装:TSSOP (DGG)-56,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT16501DGGR的批量USD价格:1.708(1000+)

SN74ABT16501DL,工作温度:-40 to 85,封装:SSOP (DL)-56,包装数量MPQ:20个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT16501DL的批量USD价格:2.22(1000+)

SN74ABT16501DLR,工作温度:-40 to 85,封装:SSOP (DL)-56,包装数量MPQ:1000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT16501DLR的批量USD价格:1.879(1000+)

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SN74ABT16501的评估套件:

SN74ABT16501DGGR,工作温度:-40 to 85,封装:TSSOP (DGG)-56,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT16501DGGR的批量USD价格:1.708(1000+)

SN74ABT16501DL,工作温度:-40 to 85,封装:SSOP (DL)-56,包装数量MPQ:20个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT16501DL的批量USD价格:2.22(1000+)

SN74ABT16501DLR,工作温度:-40 to 85,封装:SSOP (DL)-56,包装数量MPQ:1000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT16501DLR的批量USD价格:1.879(1000+)

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