- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：缓冲器、驱动器和收发器 - 反向缓冲器和驱动器
- 功能描述：具有 TTL 兼容型 CMOS 输入和三态输出的 8 通道、4.5V 至 5.5V 反相器
- 点击这里打开及下载SN74ABT2240A的技术文档资料
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These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the 'ABT2241 and 'ABT2244A, these devices provide combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE\) inputs, and complementary OE and OE\ inputs. These devices feature high fan-out and improved fan-in.
These devices are organized as two 4-bit line drivers with separate OE\ inputs. When OE\ is low, the devices pass inverted data from the A inputs to the Y outputs. When OE\ is high, the outputs are in the high-impedance state.
The outputs, which are designed to sink up to 12 mA, include equivalent 25- 
series resistors to reduce overshoot and undershoot.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT2240A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT2240A is characterized for operation from -40°C to 85°C.
- Output Ports Have Equivalent 25- Series Resistors, So No External Resistors Are Required
- State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
- Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
- Latch-Up Performance Exceeds 500 mA Per JESD 17
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package
EPIC-IIB is a trademark of Texas Instruments Incorporated.
- Technology Family
- ABT
- Supply voltage (Min) (V)
- 4.5
- Supply voltage (Max) (V)
- 5.5
- Number of channels (#)
- 8
- IOL (Max) (mA)
- 12
- IOH (Max) (mA)
- -32
- ICC (Max) (uA)
- 30000
- Input type
- TTL-Compatible CMOS
- Output type
- 3-State
- Features
- Ultra high speed (tpd <5ns), Partial power down (Ioff), Over-voltage tolerant inputs, Power up 3-state, Damping resistors
- Rating
- Catalog
SN74ABT2240A的完整型号有：SN74ABT2240ADBR、SN74ABT2240ADW、SN74ABT2240ADWR、SN74ABT2240AN、SN74ABT2240ANSR、SN74ABT2240APW、SN74ABT2240APWR，以下是这些产品的关键参数及官网采购报价：
SN74ABT2240ADBR，工作温度：-40 to 85，封装：SSOP (DB)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2240ADBR的批量USD价格：.334（1000+）
SN74ABT2240ADW，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2240ADW的批量USD价格：.365（1000+）
SN74ABT2240ADWR，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2240ADWR的批量USD价格：.304（1000+）
SN74ABT2240AN，工作温度：-40 to 85，封装：PDIP (N)-20，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2240AN的批量USD价格：.35（1000+）
SN74ABT2240ANSR，工作温度：-40 to 85，封装：SO (NS)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2240ANSR的批量USD价格：.334（1000+）
SN74ABT2240APW，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：70个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2240APW的批量USD价格：.365（1000+）
SN74ABT2240APWR，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2240APWR的批量USD价格：.304（1000+）
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
