These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the SN54ABT2240, SN74ABT2240A, and 'ABT2241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE\) inputs, and complementary OE and OE\ inputs. These devices feature high fan-out and improved fan-in.

The outputs, which are designed to sink up to 12 mA, include equivalent 25- series resistors to reduce overshoot and undershoot.

When V_CC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT2244A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT2244A is characterized for operation from -40°C to 85°C.

• Output Ports Have Equivalent 25- Series Resistors, So No External Resistors Are Required
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
• Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
• High-Impedance State During Power Up and Power Down
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Packages

EPIC-IIB is a trademark of Texas Instruments Incorporated.

• Technology Family
• ABT
• Supply voltage (Min) (V)
• 4.5
• Supply voltage (Max) (V)
• 5.5
• Number of channels (#)
• 8
• IOL (Max) (mA)
• 12
• ICC (Max) (uA)
• 30000
• IOH (Max) (mA)
• -32
• Input type
• TTL-Compatible CMOS
• Output type
• 3-State
• Features
• Ultra high speed (tpd <5ns), Partial power down (Ioff), Over-voltage tolerant inputs, Power up 3-state, Damping resistors
• Rating
• Catalog

SN74ABT2244A的完整型号有：SN74ABT2244ADBR、SN74ABT2244ADW、SN74ABT2244ADWR、SN74ABT2244AN、SN74ABT2244ANSR、SN74ABT2244APW、SN74ABT2244APWR，以下是这些产品的关键参数及官网采购报价：

SN74ABT2244ADBR，工作温度：-40 to 85，封装：SSOP (DB)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2244ADBR的批量USD价格：.31（1000+）

SN74ABT2244ADW，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2244ADW的批量USD价格：.338（1000+）

SN74ABT2244ADWR，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2244ADWR的批量USD价格：.282（1000+）

SN74ABT2244AN，工作温度：-40 to 85，封装：PDIP (N)-20，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2244AN的批量USD价格：.324（1000+）

SN74ABT2244ANSR，工作温度：-40 to 85，封装：SO (NS)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2244ANSR的批量USD价格：.31（1000+）

SN74ABT2244APW，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：70个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2244APW的批量USD价格：.338（1000+）

SN74ABT2244APWR，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT2244APWR的批量USD价格：.282（1000+）

14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM

该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。