- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:缓冲器、驱动器和收发器 - 通用收发器
- 功能描述:具有三态输出的八路收发器和线路/MOS 驱动器
- 点击这里打开及下载SN74ABT2245的技术文档资料
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These octal transceivers and line drivers are designed for asynchronous communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE\) input can be used to disable the device so the buses are effectively isolated.
The B-port outputs, which are designed to sink up to 12 mA, include equivalent 25- series resistors to reduce overshoot and undershoot.
When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.
The SN54ABT2245 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT2245 is characterized for operation from -40°C to 85°C.
- B-Port Outputs Have Equivalent 25- Series Resistors, So No External Resistors Are Required
- State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- ESD Protection Exceeds 2000 V Per MIL-STD-833, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
- High-Impedance State During Power Up and Power Down
- Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package
EPIC-IIB is a trademark of Texas Instruments Incorporated.
- IOL (Max) (mA)
- 64
- IOH (Max) (mA)
- -32
- Technology Family
- ABT
- Rating
- Catalog
- Operating temperature range (C)
- -40 to 85
SN74ABT2245的完整型号有:SN74ABT2245DBR、SN74ABT2245DW、SN74ABT2245DWR、SN74ABT2245N、SN74ABT2245PW、SN74ABT2245PWR,以下是这些产品的关键参数及官网采购报价:
SN74ABT2245DBR,工作温度:-40 to 85,封装:SSOP (DB)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT2245DBR的批量USD价格:0.32(1000+)
SN74ABT2245DW,工作温度:-40 to 85,封装:SOIC (DW)-20,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT2245DW的批量USD价格:0.349(1000+)
SN74ABT2245DWR,工作温度:-40 to 85,封装:SOIC (DW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT2245DWR的批量USD价格:0.291(1000+)
SN74ABT2245N,工作温度:-40 to 85,封装:PDIP (N)-20,包装数量MPQ:20个,MSL 等级/回流焊峰值温度:N/A for Pkg Type,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT2245N的批量USD价格:0.335(1000+)
SN74ABT2245PW,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:70个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT2245PW的批量USD价格:0.349(1000+)
SN74ABT2245PWR,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT2245PWR的批量USD价格:0.291(1000+)
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。