- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:缓冲器、驱动器和收发器 - 通用收发器
- 功能描述:具有三态输出的八路总线收发器
- 点击这里打开及下载SN74ABT245B的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格
These octal bus transceivers are designed for asynchronous communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE)\ input can be used to disable the device so the buses are effectively isolated.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.
- Typical VOLP (Output Ground Bounce) <1 V at VCC = 5 V, TA = 25°C
- Ioff and Power-Up 3-State Support Hot Insertion
- High-Drive Outputs (–32-mA IOH, 64-mA IOL)
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD 17
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- IOL (Max) (mA)
- 64
- IOH (Max) (mA)
- -32
- Technology Family
- ABT
- Rating
- Catalog
- Operating temperature range (C)
- -40 to 85
SN74ABT245B的完整型号有:SN74ABT245BDBR、SN74ABT245BDGVR、SN74ABT245BDW、SN74ABT245BDWR、SN74ABT245BN、SN74ABT245BNSR、SN74ABT245BPW、SN74ABT245BPWR、SN74ABT245BRGYR,以下是这些产品的关键参数及官网采购报价:
SN74ABT245BDBR,工作温度:-40 to 85,封装:SSOP (DB)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT245BDBR的批量USD价格:0.29(1000+)
SN74ABT245BDGVR,工作温度:-40 to 85,封装:TVSOP (DGV)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT245BDGVR的批量USD价格:0.29(1000+)
SN74ABT245BDW,工作温度:-40 to 85,封装:SOIC (DW)-20,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT245BDW的批量USD价格:0.348(1000+)
SN74ABT245BDWR,工作温度:-40 to 85,封装:SOIC (DW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT245BDWR的批量USD价格:0.29(1000+)
SN74ABT245BN,工作温度:-40 to 85,封装:PDIP (N)-20,包装数量MPQ:20个,MSL 等级/回流焊峰值温度:N/A for Pkg Type,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT245BN的批量USD价格:0.334(1000+)
SN74ABT245BNSR,工作温度:-40 to 85,封装:SO (NS)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT245BNSR的批量USD价格:0.537(1000+)
SN74ABT245BPW,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:70个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT245BPW的批量USD价格:0.348(1000+)
SN74ABT245BPWR,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT245BPWR的批量USD价格:0.29(1000+)
SN74ABT245BRGYR,工作温度:-40 to 85,封装:VQFN (RGY)-20,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74ABT245BRGYR的批量USD价格:0.305(1000+)
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
14-24-NL-LOGIC-EVM — Generic 14 through 24 pin non-leaded package evaluation module
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.