- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：触发器、锁存器和寄存器 - D 型锁存器
- 功能描述：具有三态输出的八路透明 D 型锁存器
- 点击这里打开及下载SN74ABT373的技术文档资料
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The eight latches of the 'ABT373 are transparent D-type latches. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.
A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.
OE\ does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT373 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT373 is characterized for operation from -40°C to 85°C.
- State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
- High-Drive Outputs (-32-mA IOH, 64-mA IOL)
- Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Package, and Plastic (N) and Ceramic (J) DIPs
EPIC-IIB is a trademark of Texas Instruments Incorporated.
- Number of channels (#)
- 8
- Technology Family
- ABT
- Supply voltage (Min) (V)
- 4.5
- Supply voltage (Max) (V)
- 5.5
- Input type
- TTL-Compatible CMOS
- Output type
- 3-State
- Clock Frequency (Max) (MHz)
- 150
- IOL (Max) (mA)
- 64
- IOH (Max) (mA)
- -32
- ICC (Max) (uA)
- 30000
- Features
- Very high speed (tpd 5-10ns), Partial power down (Ioff), Power up 3-state
SN74ABT373的完整型号有：SN74ABT373DBR、SN74ABT373DW、SN74ABT373DWR、SN74ABT373N、SN74ABT373NSR、SN74ABT373PW、SN74ABT373PWR，以下是这些产品的关键参数及官网采购报价：
SN74ABT373DBR，工作温度：-40 to 85，封装：SSOP (DB)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT373DBR的批量USD价格：.277（1000+）
SN74ABT373DW，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT373DW的批量USD价格：.302（1000+）
SN74ABT373DWR，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT373DWR的批量USD价格：.252（1000+）
SN74ABT373N，工作温度：-40 to 85，封装：PDIP (N)-20，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT373N的批量USD价格：.29（1000+）
SN74ABT373NSR，工作温度：-40 to 85，封装：SO (NS)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT373NSR的批量USD价格：.277（1000+）
SN74ABT373PW，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：70个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT373PW的批量USD价格：.302（1000+）
SN74ABT373PWR，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT373PWR的批量USD价格：.252（1000+）
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
