These 8-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

The eight flip-flops of the SN54ABT374 and SN74ABT374A are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.

A buffered output-enable () input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT374A is characterized for operation from -40°C to 85°C.

• State-of-the-Art EPIC-IIBTM BiCMOS Design Significantly Reduces Power Dissipation
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
• High-Drive Outputs (-32-mA IOH, 64-mA IOL)
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

EPIC-IIB is a trademark of Texas Instruments Incorporated.

• Number of channels (#)
• 8
• Technology Family
• ABT
• Supply voltage (Min) (V)
• 4.5
• Supply voltage (Max) (V)
• 5.5
• Input type
• TTL-Compatible CMOS
• Output type
• 3-State
• Clock Frequency (Max) (MHz)
• 150
• IOL (Max) (mA)
• 64
• IOH (Max) (mA)
• -32
• ICC (Max) (uA)
• 30000
• Features
• Very high speed (tpd 5-10ns), Partial power down (Ioff)

SN74ABT374A的完整型号有：SN74ABT374ADBR、SN74ABT374ADW、SN74ABT374ADWR、SN74ABT374AN、SN74ABT374ANSR、SN74ABT374APW、SN74ABT374APWR，以下是这些产品的关键参数及官网采购报价：

SN74ABT374ADBR，工作温度：-40 to 85，封装：SSOP (DB)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT374ADBR的批量USD价格：.32（1000+）

SN74ABT374ADW，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT374ADW的批量USD价格：.349（1000+）

SN74ABT374ADWR，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT374ADWR的批量USD价格：.291（1000+）

SN74ABT374AN，工作温度：-40 to 85，封装：PDIP (N)-20，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT374AN的批量USD价格：.335（1000+）

SN74ABT374ANSR，工作温度：-40 to 85，封装：SO (NS)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT374ANSR的批量USD价格：.32（1000+）

SN74ABT374APW，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：70个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT374APW的批量USD价格：.349（1000+）

SN74ABT374APWR，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABT374APWR的批量USD价格：.291（1000+）

14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM

该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。