These octal bus transceivers are designed for asynchronous communication between data buses. The devices transmit data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE\) input can be used to disable the device so the buses are effectively isolated.

When V_CC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for hot-insertion applications using I_off and power-up 3-state. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN54ABTH245 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABTH245 is characterized for operation from -40°C to 85°C.

• State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
• Latch-Up Performance Exceeds 500 mA Per JESD 17
• Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
• Ioff and Power-Up 3-State Support Hot Insertion
• High-Drive Outputs (-32-mA IOH, 64-mA IOL)
• Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), Thin Shrink Small-Outline (PW), and Thin Very Small-Outline (DGV) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

EPIC-IIB is a trademark of Texas Instruments Incorporated.

• IOL (Max) (mA)
• 64
• IOH (Max) (mA)
• -32
• Technology Family
• ABT
• Rating
• Catalog
• Operating temperature range (C)
• -40 to 85

SN74ABTH245的完整型号有：SN74ABTH245DBR、SN74ABTH245DW、SN74ABTH245DWR、SN74ABTH245N、SN74ABTH245PWR，以下是这些产品的关键参数及官网采购报价：

SN74ABTH245DBR，工作温度：-40 to 85，封装：SSOP (DB)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABTH245DBR的批量USD价格：.301（1000+）

SN74ABTH245DW，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABTH245DW的批量USD价格：.329（1000+）

SN74ABTH245DWR，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABTH245DWR的批量USD价格：.274（1000+）

SN74ABTH245N，工作温度：-40 to 85，封装：PDIP (N)-20，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABTH245N的批量USD价格：.315（1000+）

SN74ABTH245PWR，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ABTH245PWR的批量USD价格：.274（1000+）

14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM

该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。