- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：触发器、锁存器和寄存器 - D 型触发器
- 功能描述：具有三态输出的八路边沿触发式 D 型触发器
- 点击这里打开及下载SN74AC574的技术文档资料
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These 8-bit flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
The eight flip-flops of the ’AC574 devices are D-type edge-triggered flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.
A buffered output-enable (OE)\ input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines in a bus-organized system without need for interface or pullup components.
OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
- 2-V to 6-V VCC Operation
- Inputs Accept Voltages to 6 V
- Max tpd of 8.5 ns at 5 V
- 3-State Outputs Drive Bus Lines Directly
- Number of channels (#)
- 8
- Technology Family
- AC
- Supply voltage (Min) (V)
- 2
- Supply voltage (Max) (V)
- 6
- Input type
- Standard CMOS
- Output type
- 3-State
- Clock Frequency (Max) (MHz)
- 100
- IOL (Max) (mA)
- 24
- IOH (Max) (mA)
- -24
- ICC (Max) (uA)
- 40
- Features
- Balanced outputs, High speed (tpd 10-50ns), Positive input clamp diode
SN74AC574的完整型号有：SN74AC574DBR、SN74AC574DW、SN74AC574DWR、SN74AC574N、SN74AC574PW、SN74AC574PWR，以下是这些产品的关键参数及官网采购报价：
SN74AC574DBR，工作温度：-40 to 85，封装：SSOP (DB)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AC574DBR的批量USD价格：.301（1000+）
SN74AC574DW，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AC574DW的批量USD价格：.326（1000+）
SN74AC574DWR，工作温度：-40 to 85，封装：SOIC (DW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AC574DWR的批量USD价格：.276（1000+）
SN74AC574N，工作温度：-40 to 85，封装：PDIP (N)-20，包装数量MPQ：20个，MSL 等级/回流焊峰值温度：N/A for Pkg Type，引脚镀层/焊球材料：NIPDAU，TI官网SN74AC574N的批量USD价格：.314（1000+）
SN74AC574PW，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：70个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AC574PW的批量USD价格：.326（1000+）
SN74AC574PWR，工作温度：-40 to 85，封装：TSSOP (PW)-20，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AC574PWR的批量USD价格：.251（1000+）
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
