- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:专用逻辑 IC - 数字多路信号分离器和解码器
- 功能描述:双路 2 线路至 4 线路解码器/多路信号分离器
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The ’AHC139 devices are dual 2-line to 4-line decoders/demultiplexers designed for 2-V to 5.5-V VCC operation. These devices are designed to be used in high-performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, these decoders can be used to minimize the effects of system decoding. When used with high-speed memories utilizing a fast enable circuit, the delay times of these decoders and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoders is negligible.
- Operating Range 2-V to 5.5-V
- Designed Specifically for High-Speed Memory Decoders and Data-Transmission Systems
- Incorporate Two Enable Inputs to Simplify Cascading and/or Data Reception
- Latch-Up Performance Exceeds 250 mA Per JESD 17
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Technology Family
- AHC
- Number of channels (#)
- 2
- Operating temperature range (C)
- -40 to 125
- Rating
- Catalog
- ICC (Max) (uA)
- 40
SN74AHC139的完整型号有:SN74AHC139D、SN74AHC139DBR、SN74AHC139DGVR、SN74AHC139DR、SN74AHC139N、SN74AHC139NSR、SN74AHC139PW、SN74AHC139PWR、SN74AHC139RGYR,以下是这些产品的关键参数及官网采购报价:
SN74AHC139D,工作温度:-40 to 125,封装:SOIC (D)-16,包装数量MPQ:40个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC139D的批量USD价格:.349(1000+)
SN74AHC139DBR,工作温度:-40 to 125,封装:SSOP (DB)-16,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC139DBR的批量USD价格:.092(1000+)
SN74AHC139DGVR,工作温度:-40 to 125,封装:TVSOP (DGV)-16,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC139DGVR的批量USD价格:.084(1000+)
SN74AHC139DR,工作温度:-40 to 125,封装:SOIC (D)-16,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC139DR的批量USD价格:.084(1000+)
SN74AHC139N,工作温度:-40 to 125,封装:PDIP (N)-16,包装数量MPQ:25个,MSL 等级/回流焊峰值温度:N/A for Pkg Type,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC139N的批量USD价格:.171(1000+)
SN74AHC139NSR,工作温度:-40 to 125,封装:SO (NS)-16,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC139NSR的批量USD价格:.171(1000+)
SN74AHC139PW,工作温度:-40 to 125,封装:TSSOP (PW)-16,包装数量MPQ:90个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC139PW的批量USD价格:.349(1000+)
SN74AHC139PWR,工作温度:-40 to 125,封装:TSSOP (PW)-16,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC139PWR的批量USD价格:.088(1000+)
SN74AHC139RGYR,工作温度:-40 to 125,封装:VQFN (RGY)-16,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74AHC139RGYR的批量USD价格:.092(1000+)
14-24-LOGIC-EVM — 支持 14 到 24 引脚 PW、DB、D、DW、NS、DYY 和 DGV 封装的通用逻辑 EVM
该 EVM 设计用于支持采用 14 至 24 引脚 D、DW、DB、NS、PW、DYY 或 DGV 封装的任何逻辑器件。
14-24-NL-LOGIC-EVM — Generic 14 through 24 pin non-leaded package evaluation module
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.