- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：缓冲器、驱动器和收发器 - 反向缓冲器和驱动器
- 功能描述：增强型产品 6 通道、2V 至 5.5V 反相器
- 点击这里打开及下载SN74AHCU04-EP的技术文档资料
- TI代理渠道，提供当日发货、严格的质量标准，满足您的目标价格
The ’HC04 devices contain six independent inverters. They perform the Boolean function Y = A in positive logic.
- Controlled Baseline
- One Assembly Site
- One Test Site
- One Fabrication Site
- Extended Temperature Performance of -55°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree(1)
- Operating Range 2-V to 5.5-V VCC
- Unbuffered Outputs
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
- Technology Family
- AHC
- Supply voltage (Min) (V)
- 2
- Supply voltage (Max) (V)
- 5.5
- Number of channels (#)
- 6
- IOL (Max) (mA)
- 8
- IOH (Max) (mA)
- -8
- ICC (Max) (uA)
- 20
- Input type
- Standard CMOS
- Output type
- Push-Pull
- Features
- Balanced outputs, Very high speed (tpd 5-10ns), Over-voltage tolerant inputs, Unbuffered
- Rating
- HiRel Enhanced Product
SN74AHCU04-EP的完整型号有：SN74AHCU04MPWREP、V62/07619-01XE，以下是这些产品的关键参数及官网采购报价：
SN74AHCU04MPWREP，工作温度：-55 to 125，封装：TSSOP (PW)-14，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AHCU04MPWREP的批量USD价格：.62（1000+）
V62/07619-01XE，工作温度：-55 to 125，封装：TSSOP (PW)-14，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网V62/07619-01XE的批量USD价格：.62（1000+）
SN74AHCU04MPWREP，工作温度：-55 to 125，封装：TSSOP (PW)-14，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AHCU04MPWREP的批量USD价格：.62（1000+）
V62/07619-01XE，工作温度：-55 to 125，封装：TSSOP (PW)-14，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网V62/07619-01XE的批量USD价格：.62（1000+）
