SN74ALVTH162244_TI 具有总线保持、TTL 兼容型 CMOS 输入和三态输出的 16 通道、2.3V 至 3.6V 缓冲器

制造厂商：TI
产品类别：逻辑和电压转换
技术类目：缓冲器、驱动器和收发器 - 同相缓冲器和驱动器
功能描述：具有总线保持、TTL 兼容型 CMOS 输入和三态输出的 16 通道、2.3V 至 3.6V 缓冲器
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SN74ALVTH162244的产品详情：

The 'ALVTH162244 devices are 16-bit buffers/line drivers designed for low-voltage 2.5-V or 3.3-V V_CC operation, but with the capability to provide a TTL interface to a 5-V system environment.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical active-low output-enable (OE\) inputs.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

When V_CC is between 0 and 1.2 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.2 V, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

All outputs are designed to sink up to 12 mA and include equivalent 30- resistors to reduce overshoot and undershoot.

The SN54ALVTH162244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH162244 is characterized for operation from -40°C to 85°C.

SN74ALVTH162244的优势和特性：

State-of-the-Art Advanced BiCMOS Technology (ABT) WidebusTM Design for 2.5-V and 3.3-V Operation and Low Static Power Dissipation
Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
Power Off Disables Outputs, Permitting Live Insertion
High-Impedance State During Power Up and Power Down Prevents Driver Conflict
Uses Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
Output Ports Have Equivalent 30- Series Resistors, So No External Resistors Are Required
Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
Latch-Up Performance Exceeds 250 mA Per JESD 17
ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model; and Exceeds 1000 V Using Charged-Device Model, Robotic Method
Flow-Through Architecture Facilitates Printed Circuit Board Layout
Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package

NOTE: For order entry: The DGG package is abbreviated to G, and the DGV package is abbreviated to V.

Widebus is a trademark of Texas Instruments Incorporated.

SN74ALVTH162244的参数（英文）：

Technology Family
ALVT
Supply voltage (Min) (V)
2.3
Supply voltage (Max) (V)
3.6
Number of channels (#)
16
IOL (Max) (mA)
12
ICC (Max) (uA)
5000
IOH (Max) (mA)
-12
Input type
TTL-Compatible CMOS
Output type
3-State
Features
Balanced outputs, Over-voltage tolerant inputs, Damping resistors, Bus-hold
Rating
Catalog

SN74ALVTH162244具体的完整产品型号参数及价格（美元）：

SN74ALVTH162244的完整型号有：SN74ALVTH162244DL、SN74ALVTH162244GR、SN74ALVTH162244LR、SN74ALVTH162244VR，以下是这些产品的关键参数及官网采购报价：

SN74ALVTH162244DL，工作温度：-40 to 85，封装：SSOP (DL)-48，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ALVTH162244DL的批量USD价格：.738（1000+）

SN74ALVTH162244GR，工作温度：-40 to 85，封装：TSSOP (DGG)-48，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ALVTH162244GR的批量USD价格：.547（1000+）

SN74ALVTH162244LR，工作温度：-40 to 85，封装：SSOP (DL)-48，包装数量MPQ：1000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ALVTH162244LR的批量USD价格：.602（1000+）

SN74ALVTH162244VR，工作温度：-40 to 85，封装：TVSOP (DGV)-48，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ALVTH162244VR的批量USD价格：2.052（1000+）

SN74ALVTH162244的评估套件：

SN74ALVTH162244的电路图解：

SN74ALVTH162244的评估套件：