- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：缓冲器、驱动器和收发器 - 反向缓冲器和驱动器
- 功能描述：具有总线保持、TTL 兼容型 CMOS 输入和三态输出的 16 通道、2.3V 至 3.6V 反相器
- 点击这里打开及下载SN74ALVTH16240的技术文档资料
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The 'ALVTH16240 devices are 16-bit buffers/line drivers designed for 2.5-V or 3.3-V VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
These devices are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. The devices provide inverting outputs and symmetrical active-low output-enable (OE\) inputs.
When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN54ALVTH16240 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ALVTH16240 is characterized for operation from -40°C to 85°C.
- State-of-the-Art Advanced BiCMOS Technology (ABT) WidebusTM Design for 2.5-V and 3.3-V Operation and Low Static Power Dissipation
- Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 2.3-V to 3.6-V VCC)
- Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
- High Drive (-24/24 mA at 2.5-V and -32/64 mA at 3.3-V VCC)
- Power Off Disables Outputs, Permitting Live Insertion
- High-Impedance State During Power Up and Power Down Prevents Driver Conflict
- Use Bus Hold on Data Inputs in Place of External Pullup/Pulldown Resistors to Prevent the Bus From Floating
- Auto3-State Eliminates Bus Current Loading When Output Exceeds VCC + 0.5 V
- Latch-Up Performance Exceeds 250 mA Per JESD 17
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model; and Exceeds 1000 V Using Charged-Device Model, Robotic Method
- Flow-Through Architecture Facilitates Printed Circuit Board Layout
- Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
- Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), Thin Very Small-Outline (DGV) Packages, and 380-mil Fine-Pitch Ceramic Flat (WD) Package
Widebus is a trademark of Texas Instruments Incorporated.
- Technology Family
- ALVT
- Supply voltage (Min) (V)
- 2.3
- Supply voltage (Max) (V)
- 3.6
- Number of channels (#)
- 16
- IOL (Max) (mA)
- 24
- IOH (Max) (mA)
- -24
- ICC (Max) (uA)
- 5000
- Input type
- TTL-Compatible CMOS
- Output type
- 3-State
- Features
- Balanced outputs, Over-voltage tolerant inputs, Bus-hold
- Rating
- Catalog
SN74ALVTH16240的完整型号有：SN74ALVTH16240DL、SN74ALVTH16240GR，以下是这些产品的关键参数及官网采购报价：
SN74ALVTH16240DL，工作温度：-40 to 85，封装：SSOP (DL)-48，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ALVTH16240DL的批量USD价格：0.502（1000+）
SN74ALVTH16240GR，工作温度：-40 to 85，封装：TSSOP (DGG)-48，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ALVTH16240GR的批量USD价格：0.502（1000+）
SN74ALVTH16240DL，工作温度：-40 to 85，封装：SSOP (DL)-48，包装数量MPQ：25个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ALVTH16240DL的批量USD价格：0.502（1000+）
SN74ALVTH16240GR，工作温度：-40 to 85，封装：TSSOP (DGG)-48，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74ALVTH16240GR的批量USD价格：0.502（1000+）
