- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：缓冲器、驱动器和收发器 - 反向缓冲器和驱动器
- 功能描述：具有漏极开路输出的单路 0.8V 至 2.7V 高速反相器
- 点击这里打开及下载SN74AUC1G06的技术文档资料
- TI代理渠道，提供当日发货、严格的质量标准，满足您的目标价格
This single inverter buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.
The output of the SN74AUC1G06 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, please refer to the TI application report, Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.
- Available in the Texas Instruments NanoStar? and NanoFree? Packages
- Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- Ioff Supports Partial-Power-Down Mode Operation
- Sub-1-V Operable
- Max tpd of 2.5 ns at 1.8 V
- Low Power Consumption, 10-μA Max ICC
- ±8-mA Output Drive at 1.8 V
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
NanoStar, NanoFree are trademarks of Texas Instruments.
- Technology Family
- AUC
- Supply voltage (Min) (V)
- 0.8
- Supply voltage (Max) (V)
- 2.7
- Number of channels (#)
- 1
- IOL (Max) (mA)
- 9
- IOH (Max) (mA)
- 0
- ICC (Max) (uA)
- 10
- Input type
- Standard CMOS
- Output type
- Open-Drain
- Features
- Ultra high speed (tpd <5ns), Partial power down (Ioff), Over-voltage tolerant inputs
- Rating
- Catalog
SN74AUC1G06的完整型号有：SN74AUC1G06DBVR、SN74AUC1G06DCKR、SN74AUC1G06YZPR，以下是这些产品的关键参数及官网采购报价：
SN74AUC1G06DBVR，工作温度：-40 to 85，封装：SOT-23 (DBV)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC1G06DBVR的批量USD价格：.106（1000+）
SN74AUC1G06DCKR，工作温度：-40 to 85，封装：SC70 (DCK)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC1G06DCKR的批量USD价格：.106（1000+）
SN74AUC1G06YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUC1G06YZPR的批量USD价格：.176（1000+）
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
