- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：缓冲器、驱动器和收发器 - 同相缓冲器和驱动器
- 功能描述：具有漏极开路输出的单路 0.8V 至 2.7V 高速缓冲器
- 点击这里打开及下载SN74AUC1G07的技术文档资料
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This single buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.
The output of the SN74AUC1G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
For more information about AUC Little Logic devices, see Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, SCEA027.
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- Available in the Texas Instruments NanoFree? Package
- Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- Ioff Supports Partial Power Down Mode and Back Drive Protection
- Sub-1-V Operable
- Max tpd of 2.5 ns at 1.8 V
- Low Power Consumption, 10-μA Maximum ICC
- ±8-mA Output Drive at 1.8 V
- Technology Family
- AUC
- Supply voltage (Min) (V)
- 0.8
- Supply voltage (Max) (V)
- 2.7
- Number of channels (#)
- 1
- IOL (Max) (mA)
- 9
- ICC (Max) (uA)
- 10
- IOH (Max) (mA)
- 0
- Input type
- Standard CMOS
- Output type
- Open-Drain
- Features
- Ultra high speed (tpd <5ns), Partial power down (Ioff), Over-voltage tolerant inputs
- Rating
- Catalog
SN74AUC1G07的完整型号有：SN74AUC1G07DBVR、SN74AUC1G07DBVRG4、SN74AUC1G07DBVT、SN74AUC1G07DCKR、SN74AUC1G07DCKT、SN74AUC1G07YZPR，以下是这些产品的关键参数及官网采购报价：
SN74AUC1G07DBVR，工作温度：-40 to 85，封装：SOT-23 (DBV)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC1G07DBVR的批量USD价格：.079（1000+）
SN74AUC1G07DBVRG4，工作温度：-40 to 85，封装：SOT-23 (DBV)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC1G07DBVRG4的批量USD价格：.138（1000+）
SN74AUC1G07DBVT，工作温度：-40 to 85，封装：SOT-23 (DBV)-5，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SN，TI官网SN74AUC1G07DBVT的批量USD价格：.306（1000+）
SN74AUC1G07DCKR，工作温度：-40 to 85，封装：SC70 (DCK)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC1G07DCKR的批量USD价格：.106（1000+）
SN74AUC1G07DCKT，工作温度：-40 to 85，封装：SC70 (DCK)-5，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC1G07DCKT的批量USD价格：.306（1000+）
SN74AUC1G07YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUC1G07YZPR的批量USD价格：.176（1000+）
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
