- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：缓冲器、驱动器和收发器 - 反向缓冲器和驱动器
- 功能描述：具有漏极开路输出的 2 通道、0.8V 至 2.7V 高速反相器
- 点击这里打开及下载SN74AUC2G06的技术文档资料
- TI代理渠道，提供当日发货、严格的质量标准，满足您的目标价格
This dual inverter buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.
The output of the SN74AUC2G06 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
- Available in the Texas Instruments NanoFree? Package
- Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- Ioff Supports Partial-Power-Down Mode Operation
- Sub-1-V Operable
- Max tpd of 2.5 ns at 1.8 V
- Low Power Consumption, 10 μA at 1.8 V
- ±8-mA Output Drive at 1.8 V
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
NanoFree is a trademark of Texas Instruments.
- Technology Family
- AUC
- Supply voltage (Min) (V)
- 0.8
- Supply voltage (Max) (V)
- 2.7
- Number of channels (#)
- 2
- IOL (Max) (mA)
- 9
- IOH (Max) (mA)
- 0
- ICC (Max) (uA)
- 10
- Input type
- Standard CMOS
- Output type
- Open-Drain
- Features
- Ultra high speed (tpd <5ns), Partial power down (Ioff), Over-voltage tolerant inputs
- Rating
- Catalog
SN74AUC2G06的完整型号有：SN74AUC2G06DBVR、SN74AUC2G06DCKR、SN74AUC2G06YZPR，以下是这些产品的关键参数及官网采购报价：
SN74AUC2G06DBVR，工作温度：-40 to 85，封装：SOT-23 (DBV)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC2G06DBVR的批量USD价格：.189（1000+）
SN74AUC2G06DCKR，工作温度：-40 to 85，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUC2G06DCKR的批量USD价格：.189（1000+）
SN74AUC2G06YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUC2G06YZPR的批量USD价格：.253（1000+）
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
