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- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:缓冲器、驱动器和收发器 - 同相缓冲器和驱动器
- 功能描述:具有漏极开路输出的 2 通道、0.8V 至 2.7V 高速缓冲器
- 点击这里打开及下载SN74AUC2G07的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格
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This dual buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.
The output of the SN74AUC2G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
- Available in the Texas Instruments NanoFree? Package
- Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- Ioff Supports Partial-Power-Down Mode Operation
- Sub-1-V Operable
- Max tpd of 2.5 ns at 1.8 V
- Low Power Consumption, 10 μA at 1.8 V
- ±8-mA Output Drive at 1.8 V
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
NanoFree is a trademark of Texas Instruments.
- Technology Family
- AUC
- Supply voltage (Min) (V)
- 0.8
- Supply voltage (Max) (V)
- 2.7
- Number of channels (#)
- 2
- IOL (Max) (mA)
- 9
- ICC (Max) (uA)
- 10
- IOH (Max) (mA)
- 0
- Input type
- Standard CMOS
- Output type
- Open-Drain
- Features
- Ultra high speed (tpd <5ns), Partial power down (Ioff), Over-voltage tolerant inputs
- Rating
- Catalog
SN74AUC2G07的完整型号有:SN74AUC2G07DBVR、SN74AUC2G07DBVT、SN74AUC2G07DCKR、SN74AUC2G07YZPR,以下是这些产品的关键参数及官网采购报价:
SN74AUC2G07DBVR,工作温度:-40 to 85,封装:SOT-23 (DBV)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AUC2G07DBVR的批量USD价格:.189(1000+)
SN74AUC2G07DBVT,工作温度:-40 to 85,封装:SOT-23 (DBV)-6,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AUC2G07DBVT的批量USD价格:.389(1000+)
SN74AUC2G07DCKR,工作温度:-40 to 85,封装:SC70 (DCK)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AUC2G07DCKR的批量USD价格:.189(1000+)
SN74AUC2G07YZPR,工作温度:-40 to 85,封装:DSBGA (YZP)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SNAGCU,TI官网SN74AUC2G07YZPR的批量USD价格:.253(1000+)
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5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
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