SN74AUP1G126_TI 具有三态输出的单路 0.8V 至 3.6V 低功耗缓冲器

SN74AUP1G126的基本参数

制造厂商：TI
产品类别：逻辑和电压转换
技术类目：缓冲器、驱动器和收发器 - 同相缓冲器和驱动器
功能描述：具有三态输出的单路 0.8V 至 3.6V 低功耗缓冲器
点击这里打开及下载SN74AUP1G126的技术文档资料
TI代理渠道，提供当日发货、严格的质量标准，满足您的目标价格

SN74AUP1G126的产品详情：

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a very low static and dynamic power consumption across the entire V_CC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see AUP – The Lowest-Power Family and Excellent Signal Integrity ).

This bus buffer gate is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is low. This device has the input-disable feature, which allows floating input signals.

To assure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

SN74AUP1G126的优势和特性：

Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Performance Tested Per JESD 22?
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
Available in the Texas Instruments NanoStar? Package
Low Static-Power Consumption (ICC = 0.9 μA Maximum)
Low Dynamic-Power Consumption (Cpd = 4 pF Typical at 3.3 V)
Low Input Capacitance (Ci = 1.5 pF Typical)
Low Noise – Overshoot and Undershoot <10% of VCC
Input-Disable Feature Allows Floating Input Conditions
Ioff Supports Partial-Power-Down Mode Operation
Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input
Wide Operating VCC Range of 0.8 V to 3.6 V
Optimized for 3.3-V Operation
3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
tpd = 4.6 ns Maximum at 3.3 V
Suitable for Point-to-Point Applications

SN74AUP1G126的参数（英文）：

Technology Family
AUP
Supply voltage (Min) (V)
0.8
Supply voltage (Max) (V)
3.6
Number of channels (#)
1
IOL (Max) (mA)
4
ICC (Max) (uA)
0.9
IOH (Max) (mA)
-4
Input type
Standard CMOS
Output type
3-State
Features
Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs
Rating
Catalog

SN74AUP1G126具体的完整产品型号参数及价格（美元）：

SN74AUP1G126的完整型号有：SN74AUP1G126DBVR、SN74AUP1G126DBVT、SN74AUP1G126DCKR、SN74AUP1G126DCKT、SN74AUP1G126DPWR、SN74AUP1G126DRLR、SN74AUP1G126DRYR、SN74AUP1G126DSFR、SN74AUP1G126YFPR、SN74AUP1G126YZPR，以下是这些产品的关键参数及官网采购报价：

SN74AUP1G126DBVR，工作温度：-40 to 85，封装：SOT-23 (DBV)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G126DBVR的批量USD价格：.106（1000+）

SN74AUP1G126DBVT，工作温度：-40 to 85，封装：SOT-23 (DBV)-5，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G126DBVT的批量USD价格：.306（1000+）

SN74AUP1G126DCKR，工作温度：-40 to 85，封装：SC70 (DCK)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G126DCKR的批量USD价格：.106（1000+）

SN74AUP1G126DCKT，工作温度：-40 to 85，封装：SC70 (DCK)-5，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G126DCKT的批量USD价格：.306（1000+）

SN74AUP1G126DPWR，工作温度：-40 to 85，封装：X2SON (DPW)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G126DPWR的批量USD价格：.117（1000+）

SN74AUP1G126DRLR，工作温度：-40 to 85，封装：SOT-5X3 (DRL)-5，包装数量MPQ：4000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G126DRLR的批量USD价格：.127（1000+）

SN74AUP1G126DRYR，工作温度：-40 to 85，封装：SON (DRY)-6，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网SN74AUP1G126DRYR的批量USD价格：.117（1000+）

SN74AUP1G126DSFR，工作温度：-40 to 85，封装：SON (DSF)-6，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G126DSFR的批量USD价格：.127（1000+）

SN74AUP1G126YFPR，工作温度：PropertyValue，封装：DSBGA (YFP)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUP1G126YFPR的批量USD价格：.166（1000+）

SN74AUP1G126YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUP1G126YZPR的批量USD价格：.176（1000+）

SN74AUP1G126的评估套件：

5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。

SN74AUP1G126的电路图解：

SN74AUP1G126的评估套件：