- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:缓冲器、驱动器和收发器 - 同相缓冲器和驱动器
- 功能描述:具有施密特触发输入的增强型产品单路 0.8V 至 3.6V 低功耗缓冲器
- 点击这里打开及下载SN74AUP1G17-EP的技术文档资料
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The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity.
This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching noise immunity at the input.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree(1)
- Available in the Texas Instruments NanoStar? and NanoFree? Packages
- Low Static-Power Consumption (ICC = 0.9 μA Max)
- Low Dynamic-Power Consumption (Cpd = 4.4 pF Typ at 3.3 V)
- Low Input Capacitance (CI = 1.5 pF)
- Low Noise — Overshoot and Undershoot <10% of VCC
- Ioff Supports Partial-Power-Down Mode Operation
- Includes Schmitt-Trigger Inputs
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 5.1 ns Max at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- ESD Protection Exceeds 5000 V With Human-Body Model
(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.NanoStar, NanoFree are trademarks of Texas Instruments.
- Technology Family
- AUP
- Supply voltage (Min) (V)
- 0.8
- Supply voltage (Max) (V)
- 3.6
- Number of channels (#)
- 1
- IOL (Max) (mA)
- 4
- ICC (Max) (uA)
- 0.9
- IOH (Max) (mA)
- -4
- Input type
- Schmitt-Trigger
- Output type
- Push-Pull
- Features
- Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs
- Rating
- HiRel Enhanced Product
SN74AUP1G17-EP的完整型号有:SN74AUP1G17MDCKREP、V62/07623-01XE,以下是这些产品的关键参数及官网采购报价:
SN74AUP1G17MDCKREP,工作温度:-55 to 125,封装:SC70 (DCK)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AUP1G17MDCKREP的批量USD价格:.62(1000+)
V62/07623-01XE,工作温度:-55 to 125,封装:SC70 (DCK)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网V62/07623-01XE的批量USD价格:.62(1000+)
SN74AUP1G17MDCKREP,工作温度:-55 to 125,封装:SC70 (DCK)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AUP1G17MDCKREP的批量USD价格:.62(1000+)
V62/07623-01XE,工作温度:-55 to 125,封装:SC70 (DCK)-5,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网V62/07623-01XE的批量USD价格:.62(1000+)