- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：缓冲器、驱动器和收发器 - 反向缓冲器和驱动器
- 功能描述：具有三态输出的单路 0.8V 至 3.6V 低功耗反相器
- 点击这里打开及下载SN74AUP1G240的技术文档资料
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The AUP family is TI’s premier solution to the industry’s low power needs in battery-powered portable applications. This family assures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see AUP – The Lowest-Power Family ).
This buffer/driver is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is high. This device has the input-disable feature, which allows floating input signals.
To assure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
- Available in the Texas Instruments NanoStar? Package
- Low Static-Power Consumption
- ICC = 0.9 μA Maximum
- Low Dynamic-Power Consumption
- Cpd = 4.2 pF at 3.3 V Typical
- Low Input Capacitance
- CI = 1.5 pF Typical
- Low Noise – Overshoot and Undershoot <10% of VCC
- Input-Disable Feature Allows Floating Input Conditions
- Ioff Supports Partial Power-Down-Mode Operation
- Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 4.7 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
- Technology Family
- AUP
- Supply voltage (Min) (V)
- 0.8
- Supply voltage (Max) (V)
- 3.6
- Number of channels (#)
- 1
- IOL (Max) (mA)
- 4
- IOH (Max) (mA)
- -4
- ICC (Max) (uA)
- 10
- Input type
- Standard CMOS
- Output type
- 3-State
- Features
- Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs
- Rating
- Catalog
SN74AUP1G240的完整型号有：SN74AUP1G240DBVR、SN74AUP1G240DBVT、SN74AUP1G240DCKR、SN74AUP1G240DCKT、SN74AUP1G240DPWR、SN74AUP1G240DRYR、SN74AUP1G240DSFR、SN74AUP1G240YFPR、SN74AUP1G240YZPR，以下是这些产品的关键参数及官网采购报价：
SN74AUP1G240DBVR，工作温度：-40 to 85，封装：SOT-23 (DBV)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G240DBVR的批量USD价格：0.106（1000+）
SN74AUP1G240DBVT，工作温度：-40 to 85，封装：SOT-23 (DBV)-5，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G240DBVT的批量USD价格：0.306（1000+）
SN74AUP1G240DCKR，工作温度：-40 to 85，封装：SC70 (DCK)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G240DCKR的批量USD价格：0.106（1000+）
SN74AUP1G240DCKT，工作温度：-40 to 85，封装：SC70 (DCK)-5，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G240DCKT的批量USD价格：0.306（1000+）
SN74AUP1G240DPWR，工作温度：-40 to 85，封装：X2SON (DPW)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G240DPWR的批量USD价格：0.117（1000+）
SN74AUP1G240DRYR，工作温度：-40 to 85，封装：SON (DRY)-6，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网SN74AUP1G240DRYR的批量USD价格：0.117（1000+）
SN74AUP1G240DSFR，工作温度：-40 to 85，封装：SON (DSF)-6，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G240DSFR的批量USD价格：0.127（1000+）
SN74AUP1G240YFPR，工作温度：PropertyValue，封装：DSBGA (YFP)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUP1G240YFPR的批量USD价格：0.166（1000+）
SN74AUP1G240YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUP1G240YZPR的批量USD价格：0.176（1000+）
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
