- 制造厂商:TI
- 产品类别:逻辑和电压转换
- 技术类目:逻辑门 - 可配置门
- 功能描述:低功耗可配置多功能门
- 点击这里打开及下载SN74AUP1G58的技术文档资料
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The AUP family is TIs premier solution to the industrys low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity, which produces very low undershoot and overshoot characteristics.
The SN74AUP1G58 features configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and noninverter. All inputs can be connected to VCC or GND.
The device functions as an independent gate with Schmitt-trigger inputs, which allow for slow input transition and better switching noise immunity at the input.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
- Available in the Texas Instruments NanoStar? Packages
- Low Static-Power Consumption (ICC = 0.9 μA Max)
- Low Dynamic-Power Consumption (Cpd = 4.6 pF Typ at 3.3 V)
- Low Input Capacitance (Ci = 1.5 pF Typ)
- Low Noise – Overshoot and Undershoot <10% of VCC
- Ioff Supports Partial-Power-Down Mode Operation
- Includes Schmitt-Trigger Inputs
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 5.5 ns Max at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
NanoStar is a trademark of Texas Instruments
- Technology Family
- AUP
- Supply voltage (Min) (V)
- 0.8
- Supply voltage (Max) (V)
- 3.6
- Number of channels (#)
- 1
- Inputs per channel
- 1
- IOL (Max) (mA)
- 4
- IOH (Max) (mA)
- -4
- Input type
- Schmitt-Trigger
- Output type
- Push-Pull
- Features
- Partial power down (Ioff), Over-voltage tolerant inputs, Very high speed (tpd 5-10ns)
- Data rate (Max) (Mbps)
- 100
- Rating
- Catalog
- Operating temperature range (C)
- -40 to 85
SN74AUP1G58的完整型号有:SN74AUP1G58DBVR、SN74AUP1G58DBVT、SN74AUP1G58DCKR、SN74AUP1G58DCKT、SN74AUP1G58DRLR、SN74AUP1G58DRYR、SN74AUP1G58DSFR、SN74AUP1G58YFPR、SN74AUP1G58YZPR,以下是这些产品的关键参数及官网采购报价:
SN74AUP1G58DBVR,工作温度:-40 to 85,封装:SOT-23 (DBV)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AUP1G58DBVR的批量USD价格:.106(1000+)
SN74AUP1G58DBVT,工作温度:-40 to 85,封装:SOT-23 (DBV)-6,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AUP1G58DBVT的批量USD价格:.306(1000+)
SN74AUP1G58DCKR,工作温度:-40 to 85,封装:SC70 (DCK)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AUP1G58DCKR的批量USD价格:.106(1000+)
SN74AUP1G58DCKT,工作温度:-40 to 85,封装:SC70 (DCK)-6,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AUP1G58DCKT的批量USD价格:.306(1000+)
SN74AUP1G58DRLR,工作温度:-40 to 85,封装:SOT-5X3 (DRL)-6,包装数量MPQ:4000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAUAG,TI官网SN74AUP1G58DRLR的批量USD价格:.131(1000+)
SN74AUP1G58DRYR,工作温度:-40 to 85,封装:SON (DRY)-6,包装数量MPQ:5000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAUAG,TI官网SN74AUP1G58DRYR的批量USD价格:.117(1000+)
SN74AUP1G58DSFR,工作温度:-40 to 85,封装:SON (DSF)-6,包装数量MPQ:5000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AUP1G58DSFR的批量USD价格:.127(1000+)
SN74AUP1G58YFPR,工作温度:PropertyValue,封装:DSBGA (YFP)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SNAGCU,TI官网SN74AUP1G58YFPR的批量USD价格:.166(1000+)
SN74AUP1G58YZPR,工作温度:-40 to 85,封装:DSBGA (YZP)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SNAGCU,TI官网SN74AUP1G58YZPR的批量USD价格:.17(1000+)
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。