SN74AUP1G79_TI 低功耗单路正边沿触发式 D 型触发器

SN74AUP1G79的基本参数

制造厂商：TI
产品类别：逻辑和电压转换
技术类目：触发器、锁存器和寄存器 - D 型触发器
功能描述：低功耗单路正边沿触发式 D 型触发器
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SN74AUP1G79的产品详情：

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family assures a very-low static and dynamic power consumption across the entire V_CC range of 0.8 V to 3.6 V, thus resulting in an increased battery life. The AUP devices also maintain excellent signal integrity.

The SN74AUP1G79 is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup-time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

The SN74AUP1G79 device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

SN74AUP1G79的优势和特性：

Available in the Texas Instruments NanoStar? Package
Low Static-Power Consumption: ICC = 0.9 μA Maximum
Low Dynamic-Power Consumption: Cpd = 3 pF Typical at 3.3 V
Low Input Capacitance: Ci = 1.5 pF Typical
Low Noise: Overshoot and Undershoot < 10% of VCC
Ioff Supports Partial Power-Down-Mode Operation
Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typical at 3.3 V)
Wide Operating VCC Range of 0.8 V to 3.6 V
Optimized for 3.3-V Operation
3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
tpd = 4 ns Maximum at 3.3 V
Suitable for Point-to-Point Applications
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)

SN74AUP1G79的参数（英文）：

Number of channels (#)
1
Technology Family
AUP
Supply voltage (Min) (V)
0.8
Supply voltage (Max) (V)
3.6
Input type
Standard CMOS
Output type
Push-Pull
Clock Frequency (Max) (MHz)
260
IOL (Max) (mA)
4
IOH (Max) (mA)
-4
ICC (Max) (uA)
0.9
Features
Balanced outputs, Very high speed (tpd 5-10ns), Over-voltage tolerant inputs, Partial power down (Ioff)

SN74AUP1G79具体的完整产品型号参数及价格（美元）：

SN74AUP1G79的完整型号有：SN74AUP1G79DBVR、SN74AUP1G79DBVT、SN74AUP1G79DCKR、SN74AUP1G79DCKT、SN74AUP1G79DPWR、SN74AUP1G79DRLR、SN74AUP1G79DRYR、SN74AUP1G79DSFR、SN74AUP1G79YFPR、SN74AUP1G79YZPR，以下是这些产品的关键参数及官网采购报价：

SN74AUP1G79DBVR，工作温度：-40 to 85，封装：SOT-23 (DBV)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G79DBVR的批量USD价格：.106（1000+）

SN74AUP1G79DBVT，工作温度：-40 to 85，封装：SOT-23 (DBV)-5，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G79DBVT的批量USD价格：.306（1000+）

SN74AUP1G79DCKR，工作温度：-40 to 85，封装：SC70 (DCK)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G79DCKR的批量USD价格：.079（1000+）

SN74AUP1G79DCKT，工作温度：-40 to 85，封装：SC70 (DCK)-5，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G79DCKT的批量USD价格：.306（1000+）

SN74AUP1G79DPWR，工作温度：-40 to 85，封装：X2SON (DPW)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G79DPWR的批量USD价格：.117（1000+）

SN74AUP1G79DRLR，工作温度：-40 to 85，封装：SOT-5X3 (DRL)-5，包装数量MPQ：4000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网SN74AUP1G79DRLR的批量USD价格：.127（1000+）

SN74AUP1G79DRYR，工作温度：-40 to 85，封装：SON (DRY)-6，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G79DRYR的批量USD价格：.117（1000+）

SN74AUP1G79DSFR，工作温度：-40 to 85，封装：SON (DSF)-6，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G79DSFR的批量USD价格：.127（1000+）

SN74AUP1G79YFPR，工作温度：PropertyValue，封装：DSBGA (YFP)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUP1G79YFPR的批量USD价格：.166（1000+）

SN74AUP1G79YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-5，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUP1G79YZPR的批量USD价格：.176（1000+）

SN74AUP1G79的评估套件：

5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。

SN74AUP1G79的电路图解：

SN74AUP1G79的评估套件：