The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire V_CC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

The SN74AUP1G97 features configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All inputs can be connected to V_CC or GND.

The device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

• Available in the Texas Instruments NanoStar? Package
• Low Static-Power Consumption (ICC = 0.9 μA Max)
• Low Dynamic-Power Consumption (Cpd = 4.8 pF Typ at 3.3 V)
• Low Input Capacitance (CI = 1.5 pF Typ)
• Low Noise – Overshoot and Undershoot <10% of VCC
• Ioff Supports Partial-Power-Down Mode Operation
• Includes Schmitt-Trigger Inputs
• Wide Operating VCC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
• tpd = 5.6 ns Max at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Performance Tested Per JESD 22
  • 2000-V Human-Body Model (A114-B, Class II)
  • 1000-V Charged-Device Model (C101)

NanoStar is a trademark of Texas Instruments

• Technology Family
• AUP
• Supply voltage (Min) (V)
• 0.8
• Supply voltage (Max) (V)
• 3.6
• Number of channels (#)
• 1
• Inputs per channel
• 1
• IOL (Max) (mA)
• 4
• IOH (Max) (mA)
• -4
• Input type
• Schmitt-Trigger
• Output type
• Push-Pull
• Features
• Partial power down (Ioff), Over-voltage tolerant inputs, Very high speed (tpd 5-10ns)
• Data rate (Max) (Mbps)
• 100
• Rating
• Catalog
• Operating temperature range (C)
• -40 to 85

SN74AUP1G97的完整型号有：SN74AUP1G97DBVR、SN74AUP1G97DBVT、SN74AUP1G97DCKR、SN74AUP1G97DCKT、SN74AUP1G97DRLR、SN74AUP1G97DRYR、SN74AUP1G97DSFR、SN74AUP1G97YFPR、SN74AUP1G97YZPR，以下是这些产品的关键参数及官网采购报价：

SN74AUP1G97DBVR，工作温度：-40 to 85，封装：SOT-23 (DBV)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SN，TI官网SN74AUP1G97DBVR的批量USD价格：.106（1000+）

SN74AUP1G97DBVT，工作温度：-40 to 85，封装：SOT-23 (DBV)-6，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G97DBVT的批量USD价格：.306（1000+）

SN74AUP1G97DCKR，工作温度：-40 to 85，封装：SC70 (DCK)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G97DCKR的批量USD价格：.089（1000+）

SN74AUP1G97DCKT，工作温度：-40 to 85，封装：SC70 (DCK)-6，包装数量MPQ：250个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G97DCKT的批量USD价格：.306（1000+）

SN74AUP1G97DRLR，工作温度：-40 to 85，封装：SOT-5X3 (DRL)-6，包装数量MPQ：4000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网SN74AUP1G97DRLR的批量USD价格：.131（1000+）

SN74AUP1G97DRYR，工作温度：-40 to 85，封装：SON (DRY)-6，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP1G97DRYR的批量USD价格：.117（1000+）

SN74AUP1G97DSFR，工作温度：-40 to 85，封装：SON (DSF)-6，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网SN74AUP1G97DSFR的批量USD价格：.127（1000+）

SN74AUP1G97YFPR，工作温度：PropertyValue，封装：DSBGA (YFP)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUP1G97YFPR的批量USD价格：.166（1000+）

SN74AUP1G97YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-6，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUP1G97YZPR的批量USD价格：.17（1000+）

5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。