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SN74AUP1T57的基本参数
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SN74AUP1T57的产品详情:

AUP technology is the industry’s lowest-power logic technology designed for use in battery-operated or battery backed-up equipment. The SN74AUP1T57 is designed for logic-level translation applications with input switching levels that accept 1.8-V LVCMOS signals, while operating from either a single 3.3-V or 2.5-V VCC supply.

The wide VCC range of 2.3 V to 3.6 V allows the possibility of battery voltage drop during system operation and ensures normal operation between this range.

Schmitt-trigger inputs (VT = 210 mV between positive and negative input transitions) offer improved noise immunity during switching transitions, which is especially useful on analog mixed-mode designs. Schmitt-trigger inputs reject input noise, ensure integrity of output signals, and allow for slow input signal transition.

The SN74AUP1T57 can be easily configured to perform a required gate function by connecting A, B, and C inputs to VCC or ground (see Function Selection table). Up to nine commonly used logic gate functions can be performed.

Ioff is a feature that allows for powered-down conditions (VCC = 0 V) and is important in portable and mobile applications. When VCC = 0 V, signals in the range from 0 V to 3.6 V can be applied to the inputs and outputs of the device. No damage occurs to the device under these conditions.

The SN74AUP1T57 is designed with optimized current-drive capability of 4 mA to reduce line reflections, overshoot, and undershoot caused by high-drive outputs.

NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package.

SN74AUP1T57的优势和特性:
  • Available in the Texas Instruments NanoStar? Packages
  • Single-Supply Voltage Translator
  • 1.8 V to 3.3 V (at VCC = 3.3 V)
  • 2.5 V to 3.3 V (at VCC = 3.3 V)
  • 1.8 V to 2.5 V (at VCC = 2.5 V)
  • 3.3 V to 2.5 V (at VCC = 2.5 V)
  • Nine Configurable Gate Logic Functions
  • Schmitt-Trigger Inputs Reject Input Noise and Provide Better Output Signal Integrity
  • Ioff Supports Partial-Power-Down Mode With Low Leakage Current (0.5 μA)
  • Very Low Static and Dynamic Power Consumption
  • Pb-Free Packages Available: SON (DRY or DSF), SOT-23 (DBV), SC-70 (DCK), and NanoStar WCSP
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Related Devices: SN74AUP1T58, SN74AUP1T97, and SN74AUP1T98

NanoStar is a trademark of Texas Instruments.

SN74AUP1T57的参数(英文):
  • Technology Family
  • AUP1T
  • Bits (#)
  • 1
  • High input voltage (Min) (Vih)
  • 1.35
  • High input voltage (Max) (Vih)
  • 3.6
  • Vout (Min) (V)
  • 2.3
  • Vout (Max) (V)
  • 3.6
  • IOH (Max) (mA)
  • -4
  • IOL (Max) (mA)
  • 4
SN74AUP1T57具体的完整产品型号参数及价格(美元):

SN74AUP1T57的完整型号有:SN74AUP1T57DBVR、SN74AUP1T57DBVT、SN74AUP1T57DCKR、SN74AUP1T57DRYR、SN74AUP1T57DSFR、SN74AUP1T57YFPR、SN74AUP1T57YZPR,以下是这些产品的关键参数及官网采购报价:

SN74AUP1T57DBVR,工作温度:-40 to 85,封装:SOT-23 (DBV)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AUP1T57DBVR的批量USD价格:.158(1000+)

SN74AUP1T57DBVT,工作温度:-40 to 85,封装:SOT-23 (DBV)-6,包装数量MPQ:250个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AUP1T57DBVT的批量USD价格:.358(1000+)

SN74AUP1T57DCKR,工作温度:-40 to 85,封装:SC70 (DCK)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74AUP1T57DCKR的批量USD价格:.158(1000+)

SN74AUP1T57DRYR,工作温度:-40 to 85,封装:SON (DRY)-6,包装数量MPQ:5000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAUAG,TI官网SN74AUP1T57DRYR的批量USD价格:.174(1000+)

SN74AUP1T57DSFR,工作温度:-40 to 85,封装:SON (DSF)-6,包装数量MPQ:5000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAUAG,TI官网SN74AUP1T57DSFR的批量USD价格:.19(1000+)

SN74AUP1T57YFPR,工作温度:-40 to 85,封装:DSBGA (YFP)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SNAGCU,TI官网SN74AUP1T57YFPR的批量USD价格:.182(1000+)

SN74AUP1T57YZPR,工作温度:-40 to 85,封装:DSBGA (YZP)-6,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:SNAGCU,TI官网SN74AUP1T57YZPR的批量USD价格:.177(1000+)

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SN74AUP1T57的评估套件:

5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
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