The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire V_CC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

The SN74AUP2G02 performs the Boolean function Y = A + B or Y = A ⋅ B in positive logic.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

• Available in the Texas Instruments NanoStar? Package
• Low Static-Power Consumption (ICC = 0.9 μ Maximum)
• Low Dynamic-Power Consumption (Cpd = 4.3 pF Typ at 3.3 V)
• Low Input Capacitance (Ci = 1.5 pF Typical)
• Low Noise – Overshoot and Undershoot <10% of VCC
• Ioff Supports Partial-Power-Down Mode Operation
• Wide Operating VCC Range of 0.8 V to 3.6 V
• Optimized for 3.3-V Operation
• 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
• tpd = 4.3 ns Maximum at 3.3 V
• Suitable for Point-to-Point Applications
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Performance Tested Per JESD 22
  • 2000-V Human-Body Model (A114-B, Class II)

NanoStar is a trademark of Texas Instruments.

• Technology Family
• AUP
• Number of channels (#)
• 2
• Supply voltage (Min) (V)
• 0.8
• Supply voltage (Max) (V)
• 3.6
• Inputs per channel
• 2
• IOL (Max) (mA)
• 4
• IOH (Max) (mA)
• -4
• Output type
• Push-Pull
• Input type
• Standard CMOS
• Features
• Partial power down (Ioff), Over-voltage tolerant inputs, Very high speed (tpd 5-10ns)
• Data rate (Max) (Mbps)
• 100
• Rating
• Catalog

SN74AUP2G02的完整型号有：SN74AUP2G02DCUR、SN74AUP2G02DQER、SN74AUP2G02RSER、SN74AUP2G02YFPR，以下是这些产品的关键参数及官网采购报价：

SN74AUP2G02DCUR，工作温度：-40 to 85，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP2G02DCUR的批量USD价格：.189（1000+）

SN74AUP2G02DQER，工作温度：-40 to 85，封装：X2SON (DQE)-8，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网SN74AUP2G02DQER的批量USD价格：.198（1000+）

SN74AUP2G02RSER，工作温度：-40 to 85，封装：UQFN (RSE)-8，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网SN74AUP2G02RSER的批量USD价格：.246（1000+）

SN74AUP2G02YFPR，工作温度：-40 to 85，封装：DSBGA (YFP)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUP2G02YFPR的批量USD价格：.239（1000+）

5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。