- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：逻辑门 - 与门
- 功能描述：2 通道、2 输入、0.8V 至 3.6V 低功耗与门
- 点击这里打开及下载SN74AUP2G08的技术文档资料
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The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
This dual 2-input positive-AND gate performs the Boolean function Y = A • B or Y = A\ + B\ in positive logic.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
- Available in the Texas Instruments NanoStar? Package
- Low Static-Power Consumption (ICC = 0.9 μA Max)
- Low Dynamic-Power Consumption (Cpd = 4.3 pF Typ at 3.3 V)
- Low Input Capacitance (Ci = 1.5 pF Typ)
- Low Noise – Overshoot and Undershoot <10% of VCC
- Ioff Supports Partial-Power-Down Mode Operation
- Schmitt-Trigger Action Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typ at 3.3 V)
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 5.9 ns Max at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
NanoStar is a trademark of Texas Instruments.
- Technology Family
- AUP
- Supply voltage (Min) (V)
- 0.8
- Supply voltage (Max) (V)
- 3.6
- Number of channels (#)
- 2
- Inputs per channel
- 2
- IOL (Max) (mA)
- 4
- IOH (Max) (mA)
- -4
- Input type
- Standard CMOS
- Output type
- Push-Pull
- Features
- Partial power down (Ioff), Over-voltage tolerant inputs, Very high speed (tpd 5-10ns)
- Data rate (Max) (Mbps)
- 100
- Rating
- Catalog
- Operating temperature range (C)
- -40 to 85
SN74AUP2G08的完整型号有：SN74AUP2G08DCUR、SN74AUP2G08DQER、SN74AUP2G08RSER、SN74AUP2G08YFPR、SN74AUP2G08YZPR，以下是这些产品的关键参数及官网采购报价：
SN74AUP2G08DCUR，工作温度：-40 to 85，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP2G08DCUR的批量USD价格：0.144（1000+）
SN74AUP2G08DQER，工作温度：-40 to 85，封装：X2SON (DQE)-8，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网SN74AUP2G08DQER的批量USD价格：0.198（1000+）
SN74AUP2G08RSER，工作温度：-40 to 85，封装：UQFN (RSE)-8，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网SN74AUP2G08RSER的批量USD价格：0.246（1000+）
SN74AUP2G08YFPR，工作温度：-40 to 85，封装：DSBGA (YFP)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUP2G08YFPR的批量USD价格：0.239（1000+）
SN74AUP2G08YZPR，工作温度：-40 to 85，封装：DSBGA (YZP)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUP2G08YZPR的批量USD价格：0.249（1000+）
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
