- 制造厂商：TI
- 产品类别：逻辑和电压转换
- 技术类目：缓冲器、驱动器和收发器 - 同相缓冲器和驱动器
- 功能描述：3 通道、0.8V 至 3.6V 低功耗缓冲器
- 点击这里打开及下载SN74AUP3G34的技术文档资料
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The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The SN74AUP3G34 performs the Boolean function Y = A in positive logic.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
- Available in the Texas Instruments NanoStar? Package
- Low Static-Power Consumption (ICC = 0.9 μA Maximum)
- Low Dynamic-Power Consumption (Cpd = 4.3 pF Typ at 3.3 V)
- Low Input Capacitance (Ci = 1.5 pF Typical)
- Low Noise – Overshoot and Undershoot <10% of VCC
- Ioff Supports Partial-Power-Down Mode Operation
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 4.3 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
NanoStar Is a trademark of Texas Instruments
- Technology Family
- AUP
- Supply voltage (Min) (V)
- 0.8
- Supply voltage (Max) (V)
- 3.6
- Number of channels (#)
- 3
- IOL (Max) (mA)
- 4
- ICC (Max) (uA)
- 0.9
- IOH (Max) (mA)
- -4
- Input type
- Standard CMOS
- Output type
- Push-Pull
- Features
- Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs
- Rating
- Catalog
SN74AUP3G34的完整型号有：SN74AUP3G34DCUR、SN74AUP3G34DCURG4、SN74AUP3G34DQER、SN74AUP3G34RSER、SN74AUP3G34YFPR，以下是这些产品的关键参数及官网采购报价：
SN74AUP3G34DCUR，工作温度：-40 to 85，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP3G34DCUR的批量USD价格：.132（1000+）
SN74AUP3G34DCURG4，工作温度：-40 to 85，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74AUP3G34DCURG4的批量USD价格：.217（1000+）
SN74AUP3G34DQER，工作温度：-40 to 85，封装：X2SON (DQE)-8，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网SN74AUP3G34DQER的批量USD价格：.256（1000+）
SN74AUP3G34RSER，工作温度：-40 to 85，封装：UQFN (RSE)-8，包装数量MPQ：5000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAUAG，TI官网SN74AUP3G34RSER的批量USD价格：.317（1000+）
SN74AUP3G34YFPR，工作温度：-40 to 85，封装：DSBGA (YFP)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SNAGCU，TI官网SN74AUP3G34YFPR的批量USD价格：.294（1000+）
5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑 EVM
灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
