The SN74CB3Q3306A is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (r_on). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus. Specifically designed to support high-bandwidth applications, the SN74CB3Q3306A provides an optimized interface solution ideally suited for broadband communications, networking, and data-intensive computing systems.

The SN74CB3Q3306A is organized as two 1-bit switches with separate output-enable (1OE, 2OE) inputs. It can be used as two 1-bit bus switches or as one 2-bit bus switch. When OE is low, the associated 1-bit bus switch is ON and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the associated 1-bit bus switch is OFF, and a high-impedance state exists between the A and B ports.

This device is fully specified for partial-power-down applications using I_off. The I_off circuitry prevents damaging current backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

• High-Bandwidth Data Path (up to 500 MHz(1))
• 5-V-Tolerant I/Os With Device Powered Up or Powered Down
• Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range (ron = 4 Ω Typ)
• Rail-to-Rail Switching on Data I/O Ports
  • 0- to 5-V Switching With 3.3-V VCC
  • 0- to 3.3-V Switching With 2.5-V VCC
  • Bidirectional Data Flow With Near-Zero Propagation Delay
• Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 3.5 pF Typ)
• Fast Switching Frequency (f OE = 20 MHz Max)
• Data and Control Inputs Provide Undershoot Clamp Diodes
• Low Power Consumption (ICC = 0.25 mA Typ)
• VCC Operating Range From 2.3 V to 3.6 V
• Data I/Os Support 0- to 5-V Signaling Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
• Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Performance Tested Per JESD 22
  • 2000-V Human-Body Model (A114-B, Class II)
  • 1000-V Charged-Device Model (C101)
• Supports Both Digital and Analog Applications: USB Interface, Differential Signal Interface, Bus Isolation, Low-Distortion Signal Gating

(1) For additional information regarding the performance characteristics of the CB3Q family, refer to the TI application report, CBT-C, CB3T, and CB3Q Signal-Switch Families, literature number SCDA008.

• Configuration
• 1:1 SPST
• Number of channels (#)
• 2
• Power supply voltage - single (V)
• 2.5, 3.3
• Protocols
• Analog, UART, I2C
• Ron (Typ) (Ohms)
• 4
• CON (Typ) (pF)
• 8
• Bandwidth (MHz)
• 500
• Operating temperature range (C)
• -40 to 85
• Features
• Powered-off protection, Supports input voltage beyond supply
• Input/output continuous current (Max) (mA)
• 64
• Rating
• Catalog
• Supply current (Typ) (uA)
• 700

SN74CB3Q3306A的完整型号有：74CB3Q3306ADCURG4、SN74CB3Q3306ADCUR、SN74CB3Q3306APW、SN74CB3Q3306APWR、SN74CB3Q3306APWRG4，以下是这些产品的关键参数及官网采购报价：

74CB3Q3306ADCURG4，工作温度：-40 to 85，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网74CB3Q3306ADCURG4的批量USD价格：0.292（1000+）

SN74CB3Q3306ADCUR，工作温度：-40 to 85，封装：VSSOP (DCU)-8，包装数量MPQ：3000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：SN，TI官网SN74CB3Q3306ADCUR的批量USD价格：0.254（1000+）

SN74CB3Q3306APW，工作温度：-40 to 85，封装：TSSOP (PW)-8，包装数量MPQ：150个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74CB3Q3306APW的批量USD价格：0.305（1000+）

SN74CB3Q3306APWR，工作温度：-40 to 85，封装：TSSOP (PW)-8，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74CB3Q3306APWR的批量USD价格：0.254（1000+）

SN74CB3Q3306APWRG4，工作温度：-40 to 85，封装：TSSOP (PW)-8，包装数量MPQ：2000个，MSL 等级/回流焊峰值温度：Level-1-260C-UNLIM，引脚镀层/焊球材料：NIPDAU，TI官网SN74CB3Q3306APWRG4的批量USD价格：0.292（1000+）

DIP-ADAPTER-EVM — DIP 适配器评估模块

借助 DIP-Adapter-EVM 加快运算放大器的原型设计和测试，该 EVM 有助于快速轻松地连接小型表面贴装 IC 并且价格低廉。您可以使用随附的 Samtec 端子板连接任何受支持的运算放大器，或者将这些端子板直接连接至现有电路。

DIP-Adapter-EVM 套件支持六种常用的业界通用封装，包括：

• D 和 U (SOIC-8)
• PW (TSSOP-8)
• DGK（MSOP-8、VSSOP-8）
• DBV（SOT23-6、SOT23-5 和 SOT23-3）
• DCK（SC70-6 和 SC70-5）
• DRL (SOT563-6)

LEADED-ADAPTER1 — 用于快速测试 TI 5、8、10、16 和 24 引脚引线式封装的表面贴装转 DIP 接头适配器

EVM-LEADED1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间，可将 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面贴装封装转换为 100mil DIP 接头。

HSPICE Model for SN74CB3Q3306A

此参考设计为智能电网输电和配电网络中的变电站自动化设备提供高可靠性、低延迟网络通信。它支持 IEC 62439 标准中使用 PRU-ICSS 的并行冗余协议 (PRP) 规范。此参考设计是 FPGA 方法的较低成本替代方法，可提供在无需额外组件的情况下添加 IEC 61850 支持等功能的灵活性和性能。