- 制造厂商:TI
- 产品类别:开关与多路复用器
- 技术类目:模拟开关和多路复用器
- 功能描述:具有 2 个控制输入的 3.3V、1:1 (SPST)、8 通道 FET 总线开关
- 点击这里打开及下载SN74CB3Q3345的技术文档资料
- TI代理渠道,提供当日发货、严格的质量标准,满足您的目标价格
The SN74CB3Q3345 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus. Specifically designed to support high-bandwidth applications, the SN74CB3Q3345 provides an optimized interface solution ideally suited for broadband communications, networking, and data-intensive computing systems.
The SN74CB3Q3384A is organized as an 8-bit bus switch with two output-enable (OE, OE) inputs. When OE is high or OE is low, the bus switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is low and OE is high, the bus switch is OFF, and a high-impedance state exists between the A and B ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging current backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver.
- High-Bandwidth Data Path (up to 500 MHz)(1)
- 5-V-Tolerant I/Os With Device Powered Up or Powered Down
- Low and Flat ON-State Resistance (ron) Characteristics Over Operating Range (ron = 4 Typ)
- Rail-to-Rail Switching on Data I/O Ports
- 0- to 5-V Switching With 3.3-V VCC
- 0- to 3.3-V Switching With 2.5-V VCC
- Bidirectional Data Flow With Near-Zero Propagation Delay
- Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 4 pF Typ)
- Fast Switching Frequency (fOE = 20 MHz Max)
- Data and Control Inputs Provide Undershoot Clamp Diodes
- Low Power Consumption (ICC = 0.7 mA Typ)
- VCC Operating Range From 2.3 V to 3.6 V
- Data I/Os Support 0- to 5-V Signaling Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
- Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
- Supports Both Digital and Analog Applications: Differential Signal Interface, Memory Interleaving, Bus Isolation, Low-Distortion Signal Gating
For additional information regarding the performance characteristics of the CB3Q family, refer to the TI application report, CBT-C, CB3T, and CB3Q Signal-Switch Families, literature number SCDA008.)
- Configuration
- 1:1 SPST
- Number of channels (#)
- 8
- Power supply voltage - single (V)
- 2.5, 3.3
- Protocols
- Analog
- Ron (Typ) (Ohms)
- 4
- CON (Typ) (pF)
- 9
- Bandwidth (MHz)
- 500
- Operating temperature range (C)
- -40 to 85
- Features
- Powered-off protection, Supports input voltage beyond supply
- Input/output continuous current (Max) (mA)
- 64
- Rating
- Catalog
- Supply current (Typ) (uA)
- 1000
SN74CB3Q3345的完整型号有:SN74CB3Q3345DBQR、SN74CB3Q3345DGVR、SN74CB3Q3345PW、SN74CB3Q3345PWR、SN74CB3Q3345RGYR,以下是这些产品的关键参数及官网采购报价:
SN74CB3Q3345DBQR,工作温度:-40 to 85,封装:SSOP (DBQ)-20,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74CB3Q3345DBQR的批量USD价格:.351(1000+)
SN74CB3Q3345DGVR,工作温度:-40 to 85,封装:TVSOP (DGV)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CB3Q3345DGVR的批量USD价格:.319(1000+)
SN74CB3Q3345PW,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:70个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CB3Q3345PW的批量USD价格:.383(1000+)
SN74CB3Q3345PWR,工作温度:-40 to 85,封装:TSSOP (PW)-20,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CB3Q3345PWR的批量USD价格:.319(1000+)
SN74CB3Q3345RGYR,工作温度:-40 to 85,封装:VQFN (RGY)-20,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74CB3Q3345RGYR的批量USD价格:.351(1000+)
LEADED-ADAPTER1 — 用于快速测试 TI 5、8、10、16 和 24 引脚引线式封装的表面贴装转 DIP 接头适配器
EVM-LEADED1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间,可将 TI 的 D、DBQ、DCT、DCU、DDF、DGS、DGV 和 PW 表面贴装封装转换为 100mil DIP 接头。