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SN74CBT3257C的基本参数
  • 制造厂商:TI
  • 产品类别:开关与多路复用器
  • 技术类目:模拟开关和多路复用器
  • 功能描述:具有 –2V 下冲保护的 5V、2:1 (SPDT)、4 通道 FET 总线开关
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SN74CBT3257C的产品详情:

The SN74CBT3257C is a high-speed TTL-compatible FET multiplexer/demultiplexer with low ON-state resistance (ron), allowing for minimal propagation delay. Active Undershoot-Protection Circuitry on the A and B ports of the SN74CBT3257C provides protection for undershoot up to –2 V by sensing an undershoot event and ensuring that the switch remains in the proper OFF state.

The SN74CBT3257C is a 4-bit 1-of-2 multiplexer/demultiplexer with a single output-enable (OE\) input. The select (S) input controls the data path of the multiplexer/demultiplexer. When OE\ is low, the multiplexer/demultiplexer is enabled and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE\ is high, the multiplexer/demultiplexer is disabled and a high-impedance state exists between the A and B ports.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

SN74CBT3257C的优势和特性:
  • Undershoot Protection for Off-Isolation on A and B Ports Up To .2 V
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron) Characteristics (ron = 3 Typical)
  • Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 5.5 pF Typical)
  • Data and Control Inputs Provide Undershoot Clamp Diodes
  • Low Power Consumption (ICC = 3 μA Max)
  • VCC Operating Range From 4 V to 5.5 V
  • Data I/Os Support 0 to 5-V Signaling Levels (0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V)
  • Control Inputs Can be Driven by TTL or 5-V/3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Supports I2C Bus Expansion
  • Supports Both Digital and Analog Applications: USB Interface, Bus Isolation, Low-Distortion Signal Gating

SN74CBT3257C的参数(英文):
  • Configuration
  • 2:1 SPDT
  • Number of channels (#)
  • 4
  • Power supply voltage - single (V)
  • 5
  • Protocols
  • Analog, JTAG, UART, I2C, SPI, RGMII, TDM, I2S
  • Ron (Typ) (Ohms)
  • 3
  • CON (Typ) (pF)
  • 16.5
  • Bandwidth (MHz)
  • 200
  • Operating temperature range (C)
  • -40 to 85
  • Features
  • Undershoot protection
  • Input/output continuous current (Max) (mA)
  • 128
  • Rating
  • Catalog
SN74CBT3257C具体的完整产品型号参数及价格(美元):

SN74CBT3257C的完整型号有:SN74CBT3257CD、SN74CBT3257CDBQR、SN74CBT3257CDBR、SN74CBT3257CDR、SN74CBT3257CPW、SN74CBT3257CPWR、SN74CBT3257CPWRG4、SN74CBT3257CRGYR,以下是这些产品的关键参数及官网采购报价:

SN74CBT3257CD,工作温度:-40 to 85,封装:SOIC (D)-16,包装数量MPQ:40个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3257CD的批量USD价格:.377(1000+)

SN74CBT3257CDBQR,工作温度:-40 to 85,封装:SSOP (DBQ)-16,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3257CDBQR的批量USD价格:.177(1000+)

SN74CBT3257CDBR,工作温度:-40 to 85,封装:SSOP (DB)-16,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3257CDBR的批量USD价格:.177(1000+)

SN74CBT3257CDR,工作温度:-40 to 85,封装:SOIC (D)-16,包装数量MPQ:2500个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3257CDR的批量USD价格:.177(1000+)

SN74CBT3257CPW,工作温度:-40 to 85,封装:TSSOP (PW)-16,包装数量MPQ:90个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3257CPW的批量USD价格:.377(1000+)

SN74CBT3257CPWR,工作温度:-40 to 85,封装:TSSOP (PW)-16,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3257CPWR的批量USD价格:.177(1000+)

SN74CBT3257CPWRG4,工作温度:-40 to 85,封装:TSSOP (PW)-16,包装数量MPQ:2000个,MSL 等级/回流焊峰值温度:Level-1-260C-UNLIM,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3257CPWRG4的批量USD价格:.204(1000+)

SN74CBT3257CRGYR,工作温度:-40 to 85,封装:VQFN (RGY)-16,包装数量MPQ:3000个,MSL 等级/回流焊峰值温度:Level-2-260C-1 YEAR,引脚镀层/焊球材料:NIPDAU,TI官网SN74CBT3257CRGYR的批量USD价格:.177(1000+)

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SN74CBT3257C的评估套件:

LEADED-ADAPTER1 — 用于快速测试 TI 5、8、10、16 和 24 引脚引线式封装的表面贴装转 DIP 接头适配器

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LEADLESS-ADAPTER1 — 用于测试 TI 6、8、10、12、14、16 和 20 引脚无引线封装的表面贴装转 DIP 接头适配器

EVM-LEADLESS1 板可对 TI 的常见引线式封装进行快速测试和电路板试验。该评估板具有足够的空间,可将 TI 的 DRC、DTP、DQE、RBW、RGY、RSE、RSV、RSW、RTE、RTJ、RUK、RUC、RUG、RUM、RUT 和 YZP 表面贴装封装转换为 100mil DIP 接头。
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